Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716487 | Latency compensation network using timing slack sensors | Sukeshwar Kannan, Mehdi Sadi | 2017-07-25 |
| 9711494 | Methods of fabricating semiconductor die assemblies | Paul A. Silvestri, Michel Koopmans | 2017-07-18 |
| 9646899 | Interconnect assemblies with probed bond pads | Owen R. Fay, Kyle K. Kirby, Jaspreet S. Gandhi | 2017-05-09 |
| 9613897 | Integrated circuits including magnetic core inductors and methods for fabricating the same | Mahesh Bhatkar, Lulu Peng, Wanbing Yi, Juan Boon Tan | 2017-04-04 |
| 9590028 | Method and device for an integrated trench capacitor | — | 2017-03-07 |
| 9553080 | Method and process for integration of TSV-middle in 3D IC stacks | Ramakanth Alapati | 2017-01-24 |
| 9553058 | Wafer backside redistribution layer warpage control | Rahul Agarwal | 2017-01-24 |
| 9536848 | Bond pad structure for low temperature flip chip bonding | Christian Klewer | 2017-01-03 |
| 9466659 | Fabrication of multilayer circuit elements | Mahesh Bhatkar, Wanbing Yi, Juan Boon Tan | 2016-10-11 |
| 9397073 | Method of using a back-end-of-line connection structure to distribute current envenly among multiple TSVs in a series for delivery to a top die | — | 2016-07-19 |
| 9379091 | Semiconductor die assemblies and semiconductor devices including same | Paul A. Silvestri, Michel Koopmans | 2016-06-28 |
| 9257383 | Method and device for an integrated trench capacitor | — | 2016-02-09 |
| 9153520 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2015-10-06 |
| 9129869 | Pillar on pad interconnect structures, semiconductor devices including same and related methods | Owen R. Fay, Christopher J. Gambee | 2015-09-08 |
| 8937309 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Paul A. Silvestri, Michel Koopmans | 2015-01-20 |
| 8828798 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Paul A. Silvestri, Michel Koopmans | 2014-09-09 |
| 8659153 | Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods | Owen R. Fay, Christopher J. Gambee | 2014-02-25 |
| 8552567 | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication | Paul A. Silvestri, Michel Koopmans | 2013-10-08 |
| 8421168 | Microelectromechanical systems microphone packaging systems | Howard Allen, Douglas Alan Hawks, Yong Liu, Stephen R. Martin | 2013-04-16 |
| 8304896 | Embedded die package and process flow using a pre-molded carrier | — | 2012-11-06 |
| 8304888 | Integrated circuit package with embedded components | Douglas Alan Hawks | 2012-11-06 |
| 7919410 | Packaging methods for imager devices | Larry D. Kinsman | 2011-04-05 |
| 7863096 | Embedded die package and process flow using a pre-molded carrier | — | 2011-01-04 |
| 7622786 | EMI shielding for imager devices | — | 2009-11-24 |