Issued Patents All Time
Showing 51–75 of 145 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5888884 | Electronic device pad relocation, precision placement, and packaging in arrays | — | 1999-03-30 |
| 5872040 | Method for fabricating a thin film capacitor | James Wilson Rose, Ernest Wayne Balch, Leonard Richard Douglas, Evan Taylor Downey, Michael Gdula | 1999-02-16 |
| 5866952 | High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate | Thomas Gorczyca, Stanton Earl Weaver | 1999-02-02 |
| 5857858 | Demountable and repairable low pitch interconnect for stacked multichip modules | Bernard Gorowitz, Ronald Frank Kolc | 1999-01-12 |
| 5849623 | Method of forming thin film resistors on organic surfaces | James Wilson Rose, Kyung Wook Paik, Michael Gdula | 1998-12-15 |
| 5785787 | Processing low dielectric constant materials for high speed electronics | Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters, Wolfgang Daum | 1998-07-28 |
| 5737458 | Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography | Herbert S. Cole, Jr., John L. Henkes | 1998-04-07 |
| 5703400 | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Thomas Bert Gorczyca | 1997-12-30 |
| 5683928 | Method for fabricating a thin film resistor | James Wilson Rose, Ernest Wayne Balch, Leonard Richard Douglas, Evan Taylor Downey, Michael Gdula | 1997-11-04 |
| 5675310 | Thin film resistors on organic surfaces | James Wilson Rose, Kyung Wook Paik, Michael Gdula | 1997-10-07 |
| 5672546 | Semiconductor interconnect method and structure for high temperature applications | — | 1997-09-30 |
| 5576517 | Low Dielectric constant materials for high speed electronics | Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters, Wolfgang Daum | 1996-11-19 |
| 5567657 | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Thomas Bert Gorczyca | 1996-10-22 |
| 5562838 | Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography | Herbert S. Cole, Jr., John L. Henkes | 1996-10-08 |
| 5554305 | Processing low dielectric constant materials for high speed electronics | Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters, Wolfgang Daum | 1996-09-10 |
| 5546654 | Vacuum fixture and method for fabricating electronic assemblies | Thomas Bert Gorczyca | 1996-08-20 |
| 5527741 | Fabrication and structures of circuit modules with flexible interconnect layers | Herbert S. Cole, Jr., Raymond Albert Fillion, Bernard Gorowitz, Ronald Frank Kolc | 1996-06-18 |
| 5525190 | Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography | Herbert S. Cole, Jr., John L. Henkes | 1996-06-11 |
| 5452182 | Flexible high density interconnect structure and flexibly interconnected system | Charles W. Eichelberger, William P. Kornrumpf | 1995-09-19 |
| 5449427 | Processing low dielectric constant materials for high speed electronics | Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters, Wolfgang Daum | 1995-09-12 |
| 5434751 | Reworkable high density interconnect structure incorporating a release layer | Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters, John H. Lupinski | 1995-07-18 |
| 5422513 | Integrated circuit chip placement in a high density interconnect structure | Walter M. Marcinkiewicz, Raymond Albert Fillion, Barry Scott Whitmore | 1995-06-06 |
| 5391516 | Method for enhancement of semiconductor device contact pads | Bernard Gorowitz | 1995-02-21 |
| 5381445 | Munitions cartridge transmitter | John E. Hershey, Menahem Lowy, Lionel M. Levinson, Amer A. Hassan, Richard Louis Frey +2 more | 1995-01-10 |
| 5366906 | Wafer level integration and testing | Constantine A. Neugebauer, Wolfgang Daum, Bernard Gorowitz, Eric J. Wildi, Michael Gdula +2 more | 1994-11-22 |