Issued Patents All Time
Showing 76–100 of 145 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5359496 | Hermetic high density interconnected electronic system | William P. Kornrumpf, Charles W. Eichelberger | 1994-10-25 |
| 5357403 | Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns | Theodore R. Haller | 1994-10-18 |
| 5353498 | Method for fabricating an integrated circuit module | Raymond Albert Fillion, Michael Gdula, Herbert S. Cole, Jr., Eric J. Wildi, Wolfgang Daum | 1994-10-11 |
| 5355102 | HDI impedance matched microwave circuit assembly | William P. Kornrumpf, Charles W. Eichelberger | 1994-10-11 |
| 5353195 | Integral power and ground structure for multi-chip modules | Raymond Albert Fillion | 1994-10-04 |
| 5348607 | High density interconnect thermoplastic die attach material and solvent die attach processing | Charles W. Eichelberger | 1994-09-20 |
| 5336928 | Hermetically sealed packaged electronic system | Constantine A. Neugebauer | 1994-08-09 |
| 5331203 | High density interconnect structure including a chamber | Charles W. Eichelberger, William P. Kornrumpf | 1994-07-19 |
| 5324687 | Method for thinning of integrated circuit chips for lightweight packaged electronic systems | — | 1994-06-28 |
| 5302547 | Systems for patterning dielectrics by laser ablation | Herbert S. Cole, Jr., Richard Joseph Saia, Thomas Bert Gorczyca, Ernest Wayne Balch | 1994-04-12 |
| 5258647 | Electronic systems disposed in a high force environment | Charles W. Eichelberger | 1993-11-02 |
| 5241456 | Compact high density interconnect structure | Walter M. Marcinkiewicz, Charles W. Eichelberger | 1993-08-31 |
| 5225023 | High density interconnect thermoplastic die attach material and solvent die attach processing | Charles W. Eichelberger | 1993-07-06 |
| 5214655 | Integrated circuit packaging configuration for rapid customized design and unique test capability | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1993-05-25 |
| 5200810 | High density interconnect structure with top mounted components | Charles W. Eichelberger | 1993-04-06 |
| 5169678 | Laser ablatable polymer dielectrics and methods | Herbert S. Cole, Jr. | 1992-12-08 |
| 5161093 | Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive | Thomas Bert Gorczyca, Stanton Earl Weaver | 1992-11-03 |
| 5157589 | Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G ' s | Herbert S. Cole, James Wilson Rose, Charles W. Eichelberger | 1992-10-20 |
| 5154793 | Method and apparatus for removing components bonded to a substrate | Charles W. Eichelberger | 1992-10-13 |
| 5151776 | Die attachment method for use in high density interconnected assemblies | Charles W. Eichelberger | 1992-09-29 |
| 5144407 | Semiconductor chip protection layer and protected chip | Charles W. Eichelberger | 1992-09-01 |
| 5108825 | Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it | Charles W. Eichelberger | 1992-04-28 |
| 5107586 | Method for interconnecting a stack of integrated circuits at a very high density | Charles W. Eichelberger | 1992-04-28 |
| 5104480 | Direct patterning of metals over a thermally inefficient surface using a laser | Charles W. Eichelberger | 1992-04-14 |
| 5094709 | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1992-03-10 |