Issued Patents All Time
Showing 101–125 of 145 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5019535 | Die attachment method using nonconductive adhesive for use in high density interconnected assemblies | Charles W. Eichelberger | 1991-05-28 |
| 5019946 | High density interconnect with high volumetric efficiency | Charles W. Eichelberger | 1991-05-28 |
| 5018150 | Reflector switched lasers | Charles W. Eichelberger | 1991-05-21 |
| 4937203 | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1990-06-26 |
| 4933042 | Method for packaging integrated circuit chips employing a polymer film overlay layer | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1990-06-12 |
| 4918811 | Multichip integrated circuit packaging method | Charles W. Eichelberger | 1990-04-24 |
| 4901136 | Multi-chip interconnection package | Constantine A. Neugebauer, Lionel M. Levinson, Homer H. Glascock, II, Charles W. Eichelberger, Richard O. Carlson | 1990-02-13 |
| 4894115 | Laser beam scanning method for forming via holes in polymer materials | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1990-01-16 |
| 4884122 | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1989-11-28 |
| 4878991 | Simplified method for repair of high density interconnect circuits | Charles W. Eichelberger | 1989-11-07 |
| 4866508 | Integrated circuit packaging configuration for rapid customized design and unique test capability | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1989-09-12 |
| 4842677 | Excimer laser patterning of a novel resist using masked and maskless process steps | Charles W. Eichelberger | 1989-06-27 |
| 4835704 | Adaptive lithography system to provide high density interconnect | Charles W. Eichelberger, Kenneth Brakeley Welles, II | 1989-05-30 |
| 4783695 | Multichip integrated circuit packaging configuration and method | Charles W. Eichelberger | 1988-11-08 |
| 4780177 | Excimer laser patterning of a novel resist | Charles W. Eichelberger | 1988-10-25 |
| 4770921 | Self-shielding multi-layer circuit boards | Thomas P. Wacker, Charles W. Eichelberger | 1988-09-13 |
| 4714516 | Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging | Charles W. Eichelberger | 1987-12-22 |
| 4646135 | System for allowing two television programs simultaneously to use the normal bandwidth for one program by chrominance time compression and luminance bandwidth reduction | Charles W. Eichelberger | 1987-02-24 |
| 4646149 | Alternate field luminance enhancement in a spectrum conserving television system | Charles W. Eichelberger | 1987-02-24 |
| 4646151 | Television frame synchronizer with independently controllable input/output rates | Kenneth Brakeley Welles, II, Charles W. Eichelberger | 1987-02-24 |
| 4646152 | Sharpness enhanced equal bandwidth luminance bandwidth compression system | Charles W. Eichelberger, Theodore G. Mihran | 1987-02-24 |
| 4571322 | Method for providing insulated holes in conducting substrate | Charles W. Eichelberger, Abraham Auerbach | 1986-02-18 |
| 4528748 | Method for fabricating a printed circuit board of desired shape | Charles W. Eichelberger, Abraham Auerbach | 1985-07-16 |
| 4522888 | Electrical conductors arranged in multiple layers | Charles W. Eichelberger | 1985-06-11 |
| 4495251 | Shielded plastic microwave oven cavity | Charles W. Eichelberger, Peter I. Cohen | 1985-01-22 |