Issued Patents All Time
Showing 51–75 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7202687 | Systems and methods for wireless semiconductor device testing | Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck | 2007-04-10 |
| 7202682 | Composite motion probing | Timothy E. Cooper, Benjamin N. Eldridge, Rod Martens, Gaetan L. Mathieu | 2007-04-10 |
| 7200930 | Probe for semiconductor devices | Gaetan L. Mathieu | 2007-04-10 |
| 7198969 | Semiconductor chip assemblies, methods of making same and components for same | Thomas H. DiStefano | 2007-04-03 |
| 7196531 | Method of manufacturing a probe card | Gary W. Grube, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Jim Chih-Chiang Tseng | 2007-03-27 |
| 7168162 | Method of manufacturing a probe card | Gary W. Grube, Benjamin N. Eldridge, Gaetan L. Mathieu | 2007-01-30 |
| 7142000 | Mounting spring elements on semiconductor devices, and wafer-level testing methodology | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2006-11-28 |
| 7140883 | Contact carriers (tiles) for populating larger substrates with spring contacts | Benjamin N. Eldridge, Gaetan L. Mathieu, Thomas H. Dozier, II, William D. Smith | 2006-11-28 |
| 7098078 | Microelectronic component and assembly having leads with offset portions | Thomas H. DiStefano | 2006-08-29 |
| 7086149 | Method of making a contact structure with a distinctly formed tip structure | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2006-08-08 |
| 7084656 | Probe for semiconductor devices | Gaetan L. Mathieu | 2006-08-01 |
| 7082682 | Contact structures and methods for making same | — | 2006-08-01 |
| 7078926 | Wafer-level burn-in and test | David V. Pedersen | 2006-07-18 |
| 7073254 | Method for mounting a plurality of spring contact elements | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2006-07-11 |
| 7064566 | Probe card assembly and kit | A. Nicholas Sporck, Benjamin N. Eldridge | 2006-06-20 |
| 7063541 | Composite microelectronic spring structure and method for making same | Gary W. Grube, Gaetan L. Mathieu | 2006-06-20 |
| 7061257 | Probe card assembly | A. Nicholas Sporck, Benjamin N. Eldridge | 2006-06-13 |
| 7059047 | Sockets for “springed” semiconductor devices | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu, David V. Pedersen +1 more | 2006-06-13 |
| 7024763 | Methods for making plated through holes usable as interconnection wire or probe attachments | Gaetan L. Mathieu, Carl V. Reynolds | 2006-04-11 |
| 7005751 | Layered microelectronic contact and method for fabricating same | Charles A. Miller, Stuart Wenzel | 2006-02-28 |
| 6956174 | Tip structures | Gaetan L. Mathieu | 2005-10-18 |
| 6940093 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, David V. Pedersen, Ralph G. Whitten | 2005-09-06 |
| 6920689 | Method for making a socket to perform testing on integrated circuits | Gaetan L. Mathieu, Carl V. Reynolds | 2005-07-26 |
| 6913468 | Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2005-07-05 |
| 6888229 | Connection components with frangible leads and bus | Thomas H. DiStefano, Gary W. Grube, Gaetan L. Mathieu, Jason Sweis, Laurie Union +1 more | 2005-05-03 |