Issued Patents All Time
Showing 101–125 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6603324 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, David V. Pedersen, Ralph G. Whitten | 2003-08-05 |
| 6597187 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, David V. Pedersen, Ralph G. Whitten | 2003-07-22 |
| 6551844 | Test assembly including a test die for testing a semiconductor product die | Benjamin N. Eldridge, David V. Pedersen, Ralph G. Whitten | 2003-04-22 |
| 6538214 | Method for manufacturing raised electrical contact pattern of controlled geometry | — | 2003-03-25 |
| 6534856 | Sockets for “springed” semiconductor devices | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu, David V. Pedersen +1 more | 2003-03-18 |
| 6525555 | Wafer-level burn-in and test | David V. Pedersen | 2003-02-25 |
| 6520778 | Microelectronic contact structures, and methods of making same | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2003-02-18 |
| 6482013 | Microelectronic spring contact element and electronic component having a plurality of spring contact elements | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2002-11-19 |
| 6475822 | Method of making microelectronic contact structures | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2002-11-05 |
| 6476333 | Raised contact structures (solder columns) | Gaetan L. Mathieu | 2002-11-05 |
| 6465893 | Stacked chip assembly | Thomas H. DiStefano | 2002-10-15 |
| 6456099 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, David V. Pedersen, Ralph G. Whitten | 2002-09-24 |
| 6442831 | Method for shaping spring elements | Thomas H. Dozier, II, Gary W. Grube, Gaetan L. Mathieu | 2002-09-03 |
| 6441315 | Contact structures with blades having a wiping motion | Benjamin N. Eldridge, Gary W. Grube, Alec Madsen, Gaetan L. Mathieu | 2002-08-27 |
| 6433419 | Face-up semiconductor chip assemblies | Thomas H. DiStefano | 2002-08-13 |
| 6429029 | Concurrent design and subsequent partitioning of product and test die | Benjamin N. Eldridge, David V. Pedersen, Ralph G. Whitten | 2002-08-06 |
| 6392306 | Semiconductor chip assembly with anisotropic conductive adhesive connections | Thomas H. DiStefano | 2002-05-21 |
| 6372527 | Methods of making semiconductor chip assemblies | Thomas H. DiStefano | 2002-04-16 |
| 6359236 | Mounting component with leads having polymeric strips | Thomas H. DiStefano, Gary W. Grube, Gaetan Mathiew | 2002-03-19 |
| 6336269 | Method of fabricating an interconnection element | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2002-01-08 |
| 6330164 | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device | David V. Pedersen, Benjamin N. Eldridge, Richard S. Roy, Gaetan L. Mathieu | 2001-12-11 |
| 6307161 | Partially-overcoated elongate contact structures | Gary W. Grube, Gaetan L. Mathieu | 2001-10-23 |
| 6279227 | Method of forming a resilient contact structure | Gaetan L. Mathieu | 2001-08-28 |
| 6272744 | Semiconductor connection components and methods with releasable lead support | Thomas H. DiStefano, Gary W. Grube, Gaetan Mathiew | 2001-08-14 |
| 6274823 | Interconnection substrates with resilient contact structures on both sides | Gaetan L. Mathieu | 2001-08-14 |