Issued Patents All Time
Showing 126–150 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6252175 | Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate | — | 2001-06-26 |
| 6246247 | Probe card assembly and kit, and methods of using same | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2001-06-12 |
| 6242803 | Semiconductor devices with integral contact structures | Gaetar L. Mathieu | 2001-06-05 |
| 6232149 | "Sockets for ""springed"" semiconductor devices" | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu, David V. Pedersen +1 more | 2001-05-15 |
| 6215196 | Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals | Benjamin N. Eldridge, Gaetan L. Mathieu, David V. Pedersen | 2001-04-10 |
| 6215670 | Method for manufacturing raised electrical contact pattern of controlled geometry | — | 2001-04-10 |
| 6184053 | Method of making microelectronic spring contact elements | Benjamin N. Eldridge, Gaetan L. Mathieu, David V. Pedersen | 2001-02-06 |
| 6184587 | Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components | Gaetar L. Mathieu | 2001-02-06 |
| 6168974 | Process of mounting spring contacts to semiconductor devices | Sung Chul Chang, William D. Smith | 2001-01-02 |
| 6133627 | Semiconductor chip package with center contacts | Thomas H. DiStefano | 2000-10-17 |
| 6110823 | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2000-08-29 |
| 6064213 | Wafer-level burn-in and test | David V. Pedersen | 2000-05-16 |
| 6054756 | Connection components with frangible leads and bus | Thomas H. DiStefano, Gary W. Grube, Gaetan L. Mathieu, Jason Sweis, Laurie Union +1 more | 2000-04-25 |
| 6049976 | Method of mounting free-standing resilient electrical contact structures to electronic components | — | 2000-04-18 |
| 6050829 | Making discrete power connections to a space transformer of a probe card assembly | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2000-04-18 |
| 6043563 | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals | Benjamin N. Eldridge, Gaetan L. Mathieu, David V. Pedersen | 2000-03-28 |
| 6032356 | Wafer-level test and burn-in, and semiconductor process | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 2000-03-07 |
| 6033935 | "Sockets for ""springed"" semiconductor devices" | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu, David V. Pedersen +1 more | 2000-03-07 |
| 6029344 | Composite interconnection element for microelectronic components, and method of making same | Gaetan L. Mathieu | 2000-02-29 |
| 6023103 | Chip-scale carrier for semiconductor devices including mounted spring contacts | Sung Chul Chang, William D. Smith | 2000-02-08 |
| 5998864 | Stacking semiconductor devices, particularly memory chips | David V. Pedersen | 1999-12-07 |
| 5998228 | Method of testing semiconductor | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1999-12-07 |
| 5994152 | Fabricating interconnects and tips using sacrificial substrates | Benjamin N. Eldridge, Gaetan L. Mathieu | 1999-11-30 |
| 5983493 | Method of temporarily, then permanently, connecting to a semiconductor device | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1999-11-16 |
| 5977618 | Semiconductor connection components and methods with releasable lead support | Thomas H. DiStefano, Gary W. Grube, Gaetan Mathiew | 1999-11-02 |