Issued Patents All Time
Showing 176–200 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5570504 | Multi-Layer circuit construction method and structure | Thomas H. DiStefano, Gary W. Grube | 1996-11-05 |
| 5558928 | Multi-layer circuit structures, methods of making same and components for use therein | Thomas H. DiStefano, Scott G. Ehrenberg | 1996-09-24 |
| 5536909 | Semiconductor connection components and methods with releasable lead support | Thomas H. DiStefano, Gary W. Grube, Gaetan Mathiew | 1996-07-16 |
| 5525545 | Semiconductor chip assemblies and components with pressure contact | Gary W. Grube, Gaetan L. Mathieu | 1996-06-11 |
| 5489749 | Semiconductor connection components and method with releasable lead support | Thomas H. DiStefano, Gary W. Grube, Gaetan Mathiew | 1996-02-06 |
| 5476211 | Method of manufacturing electrical contacts, using a sacrificial member | — | 1995-12-19 |
| 5414298 | Semiconductor chip assemblies and components with pressure contact | Gary W. Grube, Gaetan L. Mathieu | 1995-05-09 |
| 5390844 | Semiconductor inner lead bonding tool | Thomas H. DiStefano, Gaetan Mathiew, Jason Sweis, John Grange, Gary W. Grube | 1995-02-21 |
| 5367764 | Method of making a multi-layer circuit assembly | Thomas H. DiStefano, Scott G. Ehrenberg | 1994-11-29 |
| 5346861 | Semiconductor chip assemblies and methods of making same | Thomas H. DiStefano | 1994-09-13 |
| 5347159 | Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate | Thomas H. DiStefano | 1994-09-13 |
| 5282312 | Multi-layer circuit construction methods with customization features | Thomas H. DiStefano, Gary W. Grube | 1994-02-01 |
| 5258330 | Semiconductor chip assemblies with fan-in leads | Thomas H. DiStefano | 1993-11-02 |
| 5198189 | Liquid metal matrix thermal paste | Richard B. Booth, Gary W. Grube, Peter A. Gruber, Arthur R. Zingher | 1993-03-30 |
| 5192618 | Corrosion protection by FeMn by ion implantation | Gerald S. Frankel, Peter B. Madakson | 1993-03-09 |
| 5173256 | Liquid metal matrix thermal paste | Richard B. Booth, Gary W. Grube, Peter A. Gruber, Arthur R. Zingher | 1992-12-22 |
| 5148265 | Semiconductor chip assemblies with fan-in leads | Thomas H. DiStefano | 1992-09-15 |
| 5148266 | Semiconductor chip assemblies having interposer and flexible lead | Thomas H. DiStefano | 1992-09-15 |
| 5134038 | Thin film magnetic recording medium with controlled grain morphology and topology | Robert J. Baseman, Christopher V. Jahnes, Seyyed M. T. Mirzamaani, Michael A. Russak | 1992-07-28 |
| 5086558 | Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer | Gary W. Grube | 1992-02-11 |
| 5062896 | Solder/polymer composite paste and method | Wu-Song Huang, Ravi F. Saraf, Leathen Shi | 1991-11-05 |
| 4536232 | Erosion and corrosion resistant cast iron alloy containing chromium, nickel and molybdenum | Hugo R. Larson | 1985-08-20 |
| 4424853 | Foundry practices | Bruce A. Heyer | 1984-01-10 |
| 4377196 | Method of centrifugally casting a metal tube | — | 1983-03-22 |
| 4357394 | Centrifugal casting | — | 1982-11-02 |