Issued Patents All Time
Showing 151–175 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5974662 | Method of planarizing tips of probe elements of a probe card assembly | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1999-11-02 |
| 5950304 | Methods of making semiconductor chip assemblies | Thomas H. DiStefano | 1999-09-14 |
| 5926951 | Method of stacking electronic components | Gaetan L. Mathieu | 1999-07-27 |
| 5917707 | Flexible contact structure with an electrically conductive shell | Gaetan L. Mathieu | 1999-06-29 |
| 5915752 | Method of making connections to a semiconductor chip assembly | Thomas H. DiStefano, Gary W. Grube, Gaetan L. Mathieu, Jason Sweis, Laurie Union +1 more | 1999-06-29 |
| 5912046 | Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component | Benjamin N. Eldridge, Gaetan L. Mathieu | 1999-06-15 |
| 5900738 | Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method | Gaetar L. Mathieu | 1999-05-04 |
| 5897326 | Method of exercising semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1999-04-27 |
| 5884398 | Mounting spring elements on semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1999-03-23 |
| 5878486 | Method of burning-in semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1999-03-09 |
| 5864946 | Method of making contact tip structures | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1999-02-02 |
| 5852871 | Method of making raised contacts on electronic components | — | 1998-12-29 |
| 5852326 | Face-up semiconductor chip assembly | Thomas H. DiStefano | 1998-12-22 |
| 5848467 | Methods of making semiconductor chip assemblies | Thomas H. DiStefano | 1998-12-15 |
| 5832601 | Method of making temporary connections between electronic components | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1998-11-10 |
| 5829128 | Method of mounting resilient contact structures to semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1998-11-03 |
| 5820014 | Solder preforms | Thomas H. Dozier, II | 1998-10-13 |
| 5806181 | Contact carriers (tiles) for populating larger substrates with spring contacts | Benjamin N. Eldridge, Gaetan L. Mathieu, Thomas H. Dozier, II, William D. Smith | 1998-09-15 |
| 5787581 | Methods of making semiconductor connection components with releasable load support | Thomas H. DiStefano, Gary W. Grube, Gaetan Mathiew | 1998-08-04 |
| 5772451 | Sockets for electronic components and methods of connecting to electronic components | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu | 1998-06-30 |
| 5685885 | Wafer-scale techniques for fabrication of semiconductor chip assemblies | Thomas H. DiStefano | 1997-11-11 |
| 5682061 | Component for connecting a semiconductor chip to a substrate | Thomas H. DiStefano | 1997-10-28 |
| 5679977 | Semiconductor chip assemblies, methods of making same and components for same | Thomas H. DiStefano | 1997-10-21 |
| 5640761 | Method of making multi-layer circuit | Thomas H. DiStefano, Gary W. Grube | 1997-06-24 |
| 5583321 | Multi-layer circuit construction methods and structures with customization features and components for use therein | Thomas H. DiStefano, Gary W. Grube | 1996-12-10 |