IK

Igor Y. Khandros

FO Formfactor: 140 patents #3 of 177Top 2%
TE Tessera: 36 patents #12 of 271Top 5%
IBM: 6 patents #16,453 of 70,183Top 25%
AB Abex: 4 patents #3 of 69Top 5%
BL Berkeley Lights: 4 patents #27 of 97Top 30%
University of California: 2 patents #4,561 of 18,278Top 25%
IS Ist: 2 patents #6 of 49Top 15%
NT Nutcracker Therapeutics: 1 patents #9 of 11Top 85%
📍 Orinda, CA: #3 of 531 inventorsTop 1%
🗺 California: #547 of 386,348 inventorsTop 1%
Overall (All Time): #3,369 of 4,157,543Top 1%
200
Patents All Time

Issued Patents All Time

Showing 26–50 of 200 patents

Patent #TitleCo-InventorsDate
7688090 Wafer-level burn-in and test David V. Pedersen 2010-03-30
7675311 Wireless test system Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck 2010-03-09
7616016 Probe card assembly and kit Benjamin N. Eldridge, A. Nicholas Sporck 2009-11-10
7613591 Remote test facility with wireless interface to local facilities Benjamin N. Eldridge 2009-11-03
7601039 Microelectronic contact structure and method of making same Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu 2009-10-13
7579269 Microelectronic spring contact elements Benjamin N. Eldridge, Gaetan L. Mathieu, David V. Pedersen 2009-08-25
7579856 Probe structures with physically suspended electronic components John K. Gritters 2009-08-25
7557596 Test assembly including a test die for testing a semiconductor product die Benjamin N. Eldridge, David V. Pedersen, Ralph G. Whitten 2009-07-07
7550842 Integrated circuit assembly Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck, Gary W. Grube, Gaetan L. Mathieu 2009-06-23
7548055 Testing an electronic device using test data from a plurality of testers Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck 2009-06-16
7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component David V. Pedersen, Benjamin N. Eldridge 2009-05-19
7479792 Methods for making plated through holes usable as interconnection wire or probe attachments Gaetan L. Mathieu, Carl V. Reynolds 2009-01-20
7463043 Methods of probing an electronic device Timothy E. Cooper, Benjamin N. Eldridge, Rod Martens, Gaetan L. Mathieu 2008-12-09
7400157 Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes Gary W. Grube, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng 2008-07-15
7352196 Probe card assembly and kit A. Nicholas Sporck, Benjamin N. Eldridge 2008-04-01
7347702 Contact carriers (tiles) for populating larger substrates with spring contacts Benjamin N. Eldridge, Thomas H. Dozier, II, Gaetan L. Mathieu, William D. Smith 2008-03-25
7345493 Wafer-level burn-in and test David V. Pedersen 2008-03-18
7330039 Method for making a socket to perform testing on integrated circuits Gaetan L. Mathieu, Carl V. Reynolds 2008-02-12
7291910 Semiconductor chip assemblies, methods of making same and components for same Thomas H. DiStefano 2007-11-06
7271481 Microelectronic component and assembly having leads with offset portions Thomas H. DiStefano 2007-09-18
7253651 Remote test facility with wireless interface to local test facilities Benjamin N. Eldridge 2007-08-07
7225538 Resilient contact structures formed and then attached to a substrate Benjamin N. Eldridge, Gary W. Grube, Gaetan L. Mathieu 2007-06-05
7218094 Wireless test system Benjamin N. Eldridge, A. Nicholas Sporck, Charles A. Miller 2007-05-15
7218127 Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component Timothy E. Cooper, Benjamin N. Eldridge, Rod Martens, Gaetan L. Mathieu 2007-05-15
7202687 Systems and methods for wireless semiconductor device testing Benjamin N. Eldridge, Charles A. Miller, A. Nicholas Sporck 2007-04-10