Issued Patents All Time
Showing 101–116 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915721 | Semiconductor die package including IC driver and bridge | Jiangyuan Zhang, Qiuxiao Qian | 2011-03-29 |
| 7902646 | Multiphase synchronous buck converter | Tiburcio A. Maldo, Hua Yang | 2011-03-08 |
| 7855439 | Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same | — | 2010-12-21 |
| 7829988 | Stacking quad pre-molded component packages, systems using the same, and methods of making the same | Howard Allen, Qiuxiao Qian | 2010-11-09 |
| 7825502 | Semiconductor die packages having overlapping dice, system using the same, and methods of making the same | Scott Irving, Qiuxiao Qian | 2010-11-02 |
| 7821114 | Multiphase synchronous buck converter | Tiburcio A. Maldo, Hua Yang | 2010-10-26 |
| 7812437 | Flip chip MLP with folded heat sink | Jonathan Almeria Noquil, Jocel Gomezl | 2010-10-12 |
| 7808101 | 3D smart power module | Yumin Liu, Hua Yang, Tiburcio A. Maldo, Margie T. Rios | 2010-10-05 |
| 7793253 | Mask-patterns including intentional breaks | Daniel Abrams, Danping Peng, Paul Rissman | 2010-09-07 |
| 7791084 | Package with overlapping devices | Yumin Liu | 2010-09-07 |
| 7768123 | Stacked dual-die packages, methods of making, and systems incorporating said packages | Howard Allen, Qiuxiao Qian, Jianhong Ju | 2010-08-03 |
| 7768108 | Semiconductor die package including embedded flip chip | Jeff Ju, Zhongfa Yuan, Roger Luo | 2010-08-03 |
| 7750445 | Stacked synchronous buck converter | Qiuxiao Qian, Honorio T. Granada, Jr. | 2010-07-06 |
| 7745244 | Pin substrate and package | Zhongfa Yuan, Yumin Liu, Qiuxiao Qian | 2010-06-29 |
| 7696612 | Multiphase synchronous buck converter | Tiburcio A. Maldo, Hua Yang | 2010-04-13 |
| 7589338 | Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice | Zhengyu Zhu, Zhongfa Yuan | 2009-09-15 |