Issued Patents All Time
Showing 76–100 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8410463 | Optocoupler devices | — | 2013-04-02 |
| 8389338 | Embedded die package on package (POP) with pre-molded leadframe | Qiuxiao Qian | 2013-03-05 |
| 8367481 | Four MOSFET full bridge module | Qiuxiao Qian, Jiangyuan Zhang, Mike Speed, JungTae Lee, Luke Huiyong Chung | 2013-02-05 |
| 8314499 | Flexible and stackable semiconductor die packages having thin patterned conductive layers | — | 2012-11-20 |
| 8247269 | Wafer level embedded and stacked die power system-in-package packages | — | 2012-08-21 |
| 8222081 | Wafer level buck converter | Qi Wang | 2012-07-17 |
| 8211747 | Wafer level stack die package | Dan Kinzer, Stephen R. Martin | 2012-07-03 |
| 8198710 | Folded leadframe multiple die package | Tiburcio A. Maldo, Hua Yang | 2012-06-12 |
| 8168473 | Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same | — | 2012-05-01 |
| 8138585 | Four mosfet full bridge module | Qiuxiao Qian, Jiangyuan Zhang, Mike Speed, JungTae Lee, Huiyong Luke Chung | 2012-03-20 |
| 8120169 | Thermally enhanced molded leadless package | Zhongfa Yuan | 2012-02-21 |
| 8119457 | Flip chip MLP with folded heat sink | Jonathan Almeria Noquil, Jocel P. Gomez | 2012-02-21 |
| 8115260 | Wafer level stack die package | Dan Kinzer, Stephen R. Martin | 2012-02-14 |
| 8106406 | Die package including substrate with molded device | Zhongfa Yuan | 2012-01-31 |
| 8102029 | Wafer level buck converter | Qi Wang | 2012-01-24 |
| 8088645 | 3D smart power module | Yumin Liu, Hua Yang, Tiburcio A. Maldo, Margie T. Rios | 2012-01-03 |
| 8082525 | Technique for correcting hotspots in mask patterns and write patterns | John F. McCarty, Kelly Gordon Russell, Linyong Pang | 2011-12-20 |
| 8063472 | Semiconductor package with stacked dice for a buck converter | William Robert Newberry, Margie T. Rios, Qiuxiao Qian | 2011-11-22 |
| 8063474 | Embedded die package on package (POP) with pre-molded leadframe | Qiuxiao Qian | 2011-11-22 |
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Margie T. Rios, Hua Yang, Yumin Liu, Tiburcio A. Maldo | 2011-10-04 |
| 8023279 | FLMP buck converter with a molded capacitor and a method of the same | Qiuxiao Qian | 2011-09-20 |
| 8018054 | Semiconductor die package including multiple semiconductor dice | Qiuxiao Qian | 2011-09-13 |
| 7973393 | Stacked micro optocouplers and methods of making the same | Yumin Liu | 2011-07-05 |
| 7952204 | Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same | Yumin Liu, Hua Yang, Tiburcio A. Maldo | 2011-05-31 |
| 7934430 | Die scale strain gauge | Scott Irving, Timwah Luk | 2011-05-03 |