Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8502313 | Double layer metal (DLM) power MOSFET | Rohit Dikshit, Mark L. Rinehimer, Michael D. Gruenhagen, Joseph A. Yedinak, Tracie Petersen +3 more | 2013-08-06 | $2,105,000 |
| 8211747 | Wafer level stack die package | Yong Liu, Stephen R. Martin | 2012-07-03 | $5,344,000 |
| 8115260 | Wafer level stack die package | Yong Liu, Stephen R. Martin | 2012-02-14 | $9,049,000 |
| 8072027 | 3D channel architecture for semiconductor devices | Suku Kim, Dan Calafut, Ihsiu Ho, Steven Sapp, Ashok Challa +2 more | 2011-12-06 | $2,739,000 |
| 6040626 | Semiconductor package | Chuan Cheah, Jorge Munoz | 2000-03-21 | $30,194,000 |