Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package

Semiconductor package

US Patent 6040626 · Granted Mar 21, 2000

Estimated economic value: $30,194,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of processing a semiconductor wafer, semiconductor die, and method of pro2025
Entropic clustering of objects2022
Entropic classification of objects2021
Bond pad and clip configuration for packaged semiconductor device2020
Breakable substrate for semiconductor die2019
Compact high-voltage semiconductor package2018
Magnetic nanomechanical devices for stiction compensation2018
Compact high-voltage semiconductor package2017
Stacked half-bridge package2017
Stacked half-bridge package2017
Semiconductor package with conductive clips2016
Power semiconductor package with a common conductive clip2016