| 8598035 |
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same |
Michael D. Gruenhagen, Suku Kim, James J. Murphy, Eddy Tjhia, Chung-Lin Wu +1 more |
2013-12-03 |
| 8072027 |
3D channel architecture for semiconductor devices |
Suku Kim, Dan Calafut, Ihsiu Ho, Dan Kinzer, Steven Sapp +2 more |
2011-12-06 |
| 8058732 |
Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same |
Michael D. Gruenhagen, Suku Kim, James J. Murphy, Ihsiu Ho, Eddy Tjhia +2 more |
2011-11-15 |
| 7960800 |
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same |
Michael D. Gruenhagen, Suku Kim, James J. Murphy, Eddy Tjhia, Chung-Lin Wu +1 more |
2011-06-14 |
| 5182880 |
Door frame cladding apparatus |
Richard H. Berge, Jr. |
1993-02-02 |