Issued Patents All Time
Showing 76–100 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7413983 | Plating method including pretreatment of a surface of a base metal | Akira Susaki | 2008-08-19 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2008-06-17 |
| 7344986 | Plating solution, semiconductor device and method for manufacturing the same | Xinming Wang, Moriji Matsumoto, Makoto Kanayama | 2008-03-18 |
| 7341634 | Apparatus for and method of processing substrate | Toshio Yokoyama, Masahiko Sekimoto, Akira Ogata, Seiji Katsuoka | 2008-03-11 |
| 7325148 | Power supply management system in parallel processing system by OS for single processors and power supply management program therefor | Yoshiyuki Ito, Junji Sakai, Masato Edahiro | 2008-01-29 |
| 7307484 | Semiconductor integrated circuit device with noise reduction function | — | 2007-12-11 |
| 7279408 | Semiconductor device, method for manufacturing the same, and plating solution | Norio Kimura, Xinming Wang, Moriji Matsumoto, Makoto Kanayama | 2007-10-09 |
| 7223690 | Substrate processing method | Fumio Kondo, Koji Mishima, Akira Tanaka, Yoko Suzuki, Tetsuji Togawa | 2007-05-29 |
| 7220631 | Method for fabricating semiconductor device having high withstand voltage transistor | Hitoshi Asada | 2007-05-22 |
| 7208074 | Substrate processing apparatus and substrate plating apparatus | Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Kenji Nakamura +3 more | 2007-04-24 |
| 7157370 | Semiconductor device and method for manufacturing the same | Akira Susaki | 2007-01-02 |
| 7060618 | Semiconductor device, method for manufacturing the same, and plating solution | Norio Kimura, Xinming Wang, Moriji Matsumoto, Makoto Kanayama | 2006-06-13 |
| 7033463 | Substrate plating method and apparatus | Akihisa Hongo, Naoaki Ogure, Satoshi Sendai, Tetsuma Ikegami, Koji Mishima +4 more | 2006-04-25 |
| 6936302 | Electroless Ni-B plating liquid, electronic device and method for manufacturing the same | Kenji Nakamura, Moriji Matsumoto, Hirokazu Ezawa, Masahiro Miyata, Manabu Tsujimura | 2005-08-30 |
| 6929722 | Substrate plating apparatus | Akihisa Hongo, Naoaki Ogure, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura +2 more | 2005-08-16 |
| 6912849 | Cylinder driving system and energy regenerating method thereof | Noboru Kanayama, Koichiro Itow, Hikosaburo Hiraki, Hideaki Saito | 2005-07-05 |
| 6894711 | Thermal transfer recording web roll | Noboru Yamakawa, Hitoshi Saito, Hisaki Ota, Junichi Hiroi, Tatsuya Kita +2 more | 2005-05-17 |
| 6861704 | Semiconductor device and method for fabricating the same | Hitoshi Asada | 2005-03-01 |
| 6858084 | Plating apparatus and method | Koji Mishima, Tsutomu Karimata, Kenji Nakamura, Moriji Matsumoto, Junji Kunisawa | 2005-02-22 |
| 6828225 | Substrate processing method | Fumio Kondo, Koji Mishima, Akira Tanaka, Yoko Suzuki, Tetsuji Togawa | 2004-12-07 |
| 6821902 | Electroless plating liquid and semiconductor device | Kenji Nakamura, Moriji Matsumoto | 2004-11-23 |
| 6790763 | Substrate processing method | Fumio Kondo, Koji Mishima, Akira Tanaka, Yoko Suzuki, Tetsuji Togawa | 2004-09-14 |
| 6787467 | Method of forming embedded copper interconnections and embedded copper interconnection structure | Naoaki Ogure | 2004-09-07 |
| 6752727 | Golf club head and method of manufacturing the same | Mutsumi Harada, Atsushi Uchida, Tatsuya Hirakawa | 2004-06-22 |
| 6746589 | Plating method and plating apparatus | Koji Mishima, Natsuki Makino, Junji Kunisawa, Kenji Nakamura, Tetsuo Matsuda +2 more | 2004-06-08 |