Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10755967 | Method for transferring a useful layer | Christophe Morales | 2020-08-25 |
| 10727106 | Method for transfer of a useful layer | Christophe Morales | 2020-07-28 |
| 10651032 | Method for producing an epitaxial layer on a growth plate | Matthew Charles, Christophe Morales | 2020-05-12 |
| 10586783 | Method for direct bonding of III-V semiconductor substrates with a radical oxide layer | Bruno Imbert, Xavier Blot | 2020-03-10 |
| 10497609 | Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates | Frank Fournel, Christophe Morales, Francois Rieutord | 2019-12-03 |
| 10483111 | Metal-metal direct bonding method | Paul GONDCHARTON, Bruno Imbert | 2019-11-19 |
| 10283364 | Method for assembling substrates by bonding indium phosphate surfaces | Bruno Imbert, Xavier Blot | 2019-05-07 |
| 10276738 | Photovoltaic cell, including a crystalline silicon oxide passivation thin film, and method for producing same | Pierre Mur, Pierre-Jean Ribeyron | 2019-04-30 |
| 10100400 | Method for recycling a substrate holder | Frank Fournel, Marc Zussy | 2018-10-16 |
| 9922953 | Process for producing a structure by assembling at least two elements by direct adhesive bonding | Paul GONDCHARTON, Lamine Benaissa, Bruno Imbert | 2018-03-20 |
| 9922954 | Method for performing direct bonding between two structures | Frank Fournel, Christophe Morales | 2018-03-20 |
| 9899217 | Method for producing a strained semiconductor on insulator substrate | Shay Reboh, Yves Morand | 2018-02-20 |
| 9842742 | Method for thinning samples | Jerome Dechamp, Marc Zussy | 2017-12-12 |
| 9427948 | Manufacturing a flexible structure by transfers of layers | Maxime Argoud, Frank Fournel, Frédéric Mazen, Christophe Morales | 2016-08-30 |
| 9219004 | Method of fabricating polymer film in the cavity of a wafer | Maxime Argoud, Christophe Morales, Marc Zussy | 2015-12-22 |
| 9209068 | Method for the treatment and direct bonding of a material layer | Franck Fournel, Christophe Morales, Caroline Rauer | 2015-12-08 |
| 9076841 | Double layer transfer method | Frank Fournel, Maxime Argoud, Jeremy Da Fonseca | 2015-07-07 |
| 8975156 | Method of sealing two plates with the formation of an ohmic contact therebetween | Stephane Pocas, Jean-Francois Michaud | 2015-03-10 |
| 8906780 | Method for transferring a thin layer of monocrystalline silicon | Maxime Argoud, Christian Fretigny | 2014-12-09 |
| 8877539 | Method for producing a photovoltaic cell including the preparation of the surface of a crystalline silicon substrate | Pierre Mur, Pierre-Jean Ribeyron | 2014-11-04 |
| 8871607 | Method for producing hybrid components | Thomas Signamarcheix, Franck Fournel | 2014-10-28 |
| 8715517 | Process for fabricating an acoustic wave resonator comprising a suspended membrane | Bruno Imbert, Emmanuel Defay, Chrystel Deguet, Mathieu Pijolat | 2014-05-06 |
| 8679946 | Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate | Bernard Aspar, Eric Jalaguier, Fabrice Letertre | 2014-03-25 |
| 8628674 | Method for trimming a structure obtained by the assembly of two plates | Marc Zussy, Bernard Aspar, Chrystelle Lagahe-Blanchard | 2014-01-14 |
| 8609514 | Process for the transfer of a thin film comprising an inclusion creation step | Michel Bruel, Bernard Aspar, Christophe Maleville | 2013-12-17 |