Issued Patents All Time
Showing 51–75 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7645392 | Methods for preparing a bonding surface of a semiconductor wafer | Corinne Maunand Tussot, Christophe Maleville, Alain Soubie | 2010-01-12 |
| 7586154 | Method for fabricating a substrate with useful layer on high resistivity support | Bruno Ghyselen | 2009-09-08 |
| 7579259 | Simplified method of producing an epitaxially grown structure | Frank Fournel | 2009-08-25 |
| 7550052 | Method of producing a complex structure by assembling stressed structures | Franck Fournel, Phillippe Montmayeul | 2009-06-23 |
| 7541263 | Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized | Christophe Morales, Marc Zussy, Jerome Dechamp | 2009-06-02 |
| 7494897 | Method of producing mixed substrates and structure thus obtained | Franck Fournel, Bernard Aspar, Marc Zussy | 2009-02-24 |
| 7476595 | Method for the molecular bonding of microelectronic components to a polymer film | Christophe Morales, Lea Di Cioccio | 2009-01-13 |
| 7435690 | Method of preparing a silicon dioxide layer by high temperature oxidation on a substrate having, at least on the surface, germanium or a silicon-germanium alloy | Pierre Mur | 2008-10-14 |
| 7407867 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Bruno Ghyselen, Cecile Aulnette, Benoit Bataillou, Carlos Mazure | 2008-08-05 |
| 7268060 | Method for fabricating a substrate with useful layer on high resistivity support | Bruno Ghyselen | 2007-09-11 |
| 7264996 | Method for separating wafers bonded together to form a stacked structure | Frank Fournel, Bernard Aspar | 2007-09-04 |
| 7258743 | Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure | Franck Fournel, Bernard Aspar | 2007-08-21 |
| 7235461 | Method for bonding semiconductor structures together | Christophe Maleville, Corinne Maunand Tussot, Olivier Rayssac, Sebastien Kerdiles, Benjamin Scarfogliere +1 more | 2007-06-26 |
| 7232739 | Multifunctional metallic bonding | Sebastien Kerdiles, Fabrice Letertre, Christophe Morales | 2007-06-19 |
| 7229897 | Method for producing a stacked structure | Franck Fournel, Marc Zussy, Noël Magnea | 2007-06-12 |
| 7229899 | Process for the transfer of a thin film | Michel Bruel, Bernard Aspar, Christophe Maleville | 2007-06-12 |
| 7189632 | Multifunctional metallic bonding | Sebastien Kerdiles, Fabrice Letertre, Christophe Morales | 2007-03-13 |
| 7115481 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Bruno Ghyselen, Cecile Aulnette, Benoit Bataillou, Carlos Mazure | 2006-10-03 |
| 7041227 | Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials | Franck Fournel, Noël Magnea | 2006-05-09 |
| 6991944 | Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials | Olivier Rayssac, Beryl Blondeau, Christelle Lagahe-Blanchard, Franck Fournel | 2006-01-31 |
| 6991995 | Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer | Cecile Aulnette, Benoit Bataillou, Bruno Ghyselen | 2006-01-31 |
| 6974759 | Method for making a stacked comprising a thin film adhering to a target substrate | Bernard Aspar, Eric Jalaguier, Fabrice Letertre | 2005-12-13 |
| 6821376 | Method for separating two elements and a device therefor | Olivier Rayssac, Bernard Aspar, Philippe Montmayeul | 2004-11-23 |
| 6808967 | Method for producing a buried layer of material in another material | Bernard Aspar, Michel Bruel | 2004-10-26 |
| 6809044 | Method for making a thin film using pressurization | Bernard Aspar, Michel Bruel | 2004-10-26 |