Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10710192 | Method for adhering a first structure and a second structure | Bruno Imbert, Lamine Benaissa | 2020-07-14 |
| 10679963 | Method for assembling two substrates of different natures via a ductile intermediate layer | Bruno Imbert, Lamine Benaissa | 2020-06-09 |
| 10483111 | Metal-metal direct bonding method | Bruno Imbert, Hubert Moriceau | 2019-11-19 |
| 10403597 | Direct bonding method | Lamine Benaissa, Bruno Imbert, Guillaume Rodriguez, Chiara Sabbione | 2019-09-03 |
| 10115698 | Method for direct adhesion via low-roughness metal layers | Lamine Benaissa, Bruno Imbert | 2018-10-30 |
| 10032742 | Method for obtaining a bonding surface for direct bonding | Lamine Benaissa, Bruno Imbert | 2018-07-24 |
| 9922953 | Process for producing a structure by assembling at least two elements by direct adhesive bonding | Lamine Benaissa, Bruno Imbert, Hubert Moriceau | 2018-03-20 |
| 9735038 | Process for manufacturing a semiconductor structure with temporary bonding via metal layers | Lamine Benaissa, Anne-Marie Charvet, Bruno Imbert | 2017-08-15 |
| 9472530 | Method for carrying out a conductive direct metal bonding | Lamine Benaissa, Bruno Imbert | 2016-10-18 |