Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349593 | Functionalized object with integrated mechanical wave sensor and associated production method | Ismail Degirmencioglu, Jean-Sébestien Moulet | 2025-07-01 |
| 12234144 | Method for sealing cavities using membranes | Thierry SALVETAT, Bruno Ghyselen, Caroline COUTIER, Gweltaz Gaudin | 2025-02-25 |
| 11955375 | Composite structure, intended for a planar co-integration of electronic components of different functions | Marilyne ROUMANIE, Christelle Navone | 2024-04-09 |
| 11952808 | Device for locking and/or unlocking a motor vehicle opening panel, vehicle comprising said device and method for locking or unlocking a motor vehicle opening panel using said device | Frédérick REICHHELD, François BOLLIER, Christophe CAZES, Jean-Sebastien Moulet | 2024-04-09 |
| 11601107 | Method for the production of a bulk acoustic wave resonator with a reduced parasitic capacitance | Marie Gorisse, Alexandre Reinhardt, Jean-Sebastien Moulet | 2023-03-07 |
| 11442571 | Touch surface device | Jean-Sebastien Moulet | 2022-09-13 |
| 11401162 | Method for transferring a useful layer into a supporting substrate | Thierry SALVETAT | 2022-08-02 |
| 11380577 | Method for transferring a thin layer using a filled preceramic polymer | Marilyne Roumaine | 2022-07-05 |
| 11329188 | Optoelectronic device manufacturing method | Marc Rabarot | 2022-05-10 |
| 11171158 | SOI substrate compatible with the RFSOI and FDSOI technologies | Yann Lamy, Etienne Navarro | 2021-11-09 |
| 11127710 | Method for transferring structures | Ismail Degirmencioglu | 2021-09-21 |
| 11024544 | Assembly for 3D circuit with superposed transistor levels | Francois Andrieu, Laurent Brunet | 2021-06-01 |
| 10886158 | Method for transferring structures | — | 2021-01-05 |
| 10734439 | Method for producing an optoelectronic device comprising a plurality of gallium nitride diodes | François Templier, Marc Rabarot | 2020-08-04 |
| 10710192 | Method for adhering a first structure and a second structure | Bruno Imbert, Paul GONDCHARTON | 2020-07-14 |
| 10679963 | Method for assembling two substrates of different natures via a ductile intermediate layer | Bruno Imbert, Paul GONDCHARTON | 2020-06-09 |
| 10586810 | SOI substrate compatible with the RFSOI and FDSOI technologies | Yann Lamy, Etienne Navarro | 2020-03-10 |
| 10403597 | Direct bonding method | Paul GONDCHARTON, Bruno Imbert, Guillaume Rodriguez, Chiara Sabbione | 2019-09-03 |
| 10357917 | Method for manufacturing nanometric objects using the rupture of a layer deformed by wrinkles | Jean-Sebastien Moulet | 2019-07-23 |
| 10183441 | Method for obtaining a wavy layer locally suspended on a substrate using a deformation by formation of wrinkles | Jean-Sebastien Moulet | 2019-01-22 |
| 10115698 | Method for direct adhesion via low-roughness metal layers | Paul GONDCHARTON, Bruno Imbert | 2018-10-30 |
| 10032742 | Method for obtaining a bonding surface for direct bonding | Paul GONDCHARTON, Bruno Imbert | 2018-07-24 |
| 9997394 | Method for transferring a thin layer with supply of heat energy to a fragile zone via an inductive layer | Thomas Signamarcheix, Emmanuel Augendre | 2018-06-12 |
| 9981420 | Sensor capable of sensing pressure by means of the deformation of a wrinkled piezoelectric layer | Jean-Sebastien Moulet | 2018-05-29 |
| 9922953 | Process for producing a structure by assembling at least two elements by direct adhesive bonding | Paul GONDCHARTON, Bruno Imbert, Hubert Moriceau | 2018-03-20 |