HW

Huiyuan Wang

Applied Materials: 11 patents #1,198 of 7,310Top 20%
AM Amazon: 1 patents #10,608 of 19,158Top 60%
Ericsson: 1 patents #5,184 of 9,909Top 55%
Huawei: 1 patents #8,196 of 15,535Top 55%
Overall (All Time): #329,947 of 4,157,543Top 8%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12198936 Defect free germanium oxide gap fill Susmit Singha Roy, Takehito Koshizawa, Bo Qi, Abhijit Basu Mallick 2025-01-14
12046468 Conformal silicon-germanium film deposition Susmit Singha Roy, Abhijit Basu Mallick 2024-07-23
12018364 Super-conformal germanium oxide films Susmit Singha Roy, Takehito Koshizawa, Bo Qi, Abhijit Basu Mallick 2024-06-25
11960468 Late-binding database views Meng Tong, Naresh K. Chainani, Mengchu Cai 2024-04-16
11962474 Performance modeling for cloud applications Michel Gokan Khan, Wenfeng HU, Carolyn Cartwright 2024-04-16
11830734 Thermal deposition of silicon-germanium Susmit Singha Roy, Abhijit Basu Mallick 2023-11-28
11791155 Diffusion barriers for germanium Susmit Singha Roy, Takehito Koshizawa, Bo Qi, Abhijit Basu Mallick, Nitin K. Ingle 2023-10-17
11781218 Defect free germanium oxide gap fill Susmit Singha Roy, Takehito Koshizawa, Bo Qi, Abhijit Basu Mallick 2023-10-10
11702751 Non-conformal high selectivity film for etch critical dimension control Bo Qi, Yingli Rao, Abhijit Basu Mallick 2023-07-18
11515170 3D NAND etch Shishi Jiang, Pramit Manna, Bo Qi, Abhijit Basu Mallick, Rui Cheng +2 more 2022-11-29
11495454 Deposition of low-stress boron-containing layers Rick Kustra, Bo Qi, Abhijit Basu Mallick, Kaushik Alayavalli, Jay D. Pinson, II 2022-11-08
11404263 Deposition of low-stress carbon-containing layers Rick Kustra, Bo Qi, Abhijit Basu Mallick, Kaushik Alayavalli, Jay D. Pinson, II 2022-08-02
10886140 3D NAND etch Shishi Jiang, Pramit Manna, Bo Qi, Abhijit Basu Mallick, Rui Cheng +2 more 2021-01-05
10488903 Extended base of mobile terminal and power supply management method for extended base Chao Fu 2019-11-26