Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198974 | Dielectric gap-filling process for semiconductor device | Cheng-I Lin | 2025-01-14 |
| 11742238 | Dielectric gap-filling process for semiconductor device | Cheng-I Lin | 2023-08-29 |
| 11488855 | Dielectric gap-filling process for semiconductor device | Cheng-I Lin | 2022-11-01 |
| 11335562 | Self-aligned contact and manufacturing method thereof | Tai-Chun Huang | 2022-05-17 |
| 10937686 | Formation and in-situ treatment processes for gap fill layers | Jian-Shiou Huang, Chih-Tang Peng, Tai-Chun Huang, Yen-Chun Huang | 2021-03-02 |
| 10748808 | Dielectric gap-filling process for semiconductor device | Cheng-I Lin | 2020-08-18 |
| 10727069 | Self-aligned contact and manufacturing method thereof | Tai-Chun Huang | 2020-07-28 |
| 10643902 | Semiconductor device and method for atomic layer deposition of a dielectric over a substrate | Yen-Chun Huang, Chih-Tang Peng, Tai-Chun Huang | 2020-05-05 |
| 10361113 | Formation and in-situ treatment processes for gap fill layers | Jian-Shiou Huang, Chih-Tang Peng, Tai-Chun Huang, Yen-Chun Huang | 2019-07-23 |
| 10354923 | Semiconductor device and method for atomic layer deposition of a dielectric over a substrate | Yen-Chun Huang, Chih-Tang Peng, Tai-Chun Huang | 2019-07-16 |
| 10170318 | Self-aligned contact and manufacturing method thereof | Tai-Chun Huang | 2019-01-01 |
| 10002933 | Semiconductor device structure with cap layer with top and bottom portions over gate electrode | Tai-Chun Huang | 2018-06-19 |
| 9159907 | Hybrid film for protecting MTJ stacks of MRAM | Cheng-Yuan Tsai | 2015-10-13 |
| 8753899 | Magnetoresistive random access memory (MRAM) device and fabrication methods thereof | Cheng-Yuan Tsai | 2014-06-17 |