Issued Patents All Time
Showing 51–75 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7422516 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2008-09-09 |
| 7390744 | Method and composition for polishing a substrate | Renhe Jia, Stan Tsai, Liang-Yuh Chen | 2008-06-24 |
| 7390429 | Method and composition for electrochemical mechanical polishing processing | Tianbao Du, Alain Duboust, Wei-Yung Hsu | 2008-06-24 |
| 7384534 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Siew Neo, Stan Tsai, Liang-Yuh Chen | 2008-06-10 |
| 7375023 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Rashid Mavliev +2 more | 2008-05-20 |
| 7374644 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev +2 more | 2008-05-20 |
| 7344431 | Pad assembly for electrochemical mechanical processing | Yongqi Hu, Stan Tsai, Yan Wang, Shou-Sung Chang, Liang-Yuh Chen | 2008-03-18 |
| 7323416 | Method and composition for polishing a substrate | Tianbao Du, Alain Duboust, Yan Wang, Yongqi Hu, Stan Tsai +3 more | 2008-01-29 |
| 7307137 | Low dielectric constant materials and methods of preparation thereof | Kreisler Lau, Paul Apen, Boris Korolev, Emma Brouk, Ruslan Zherebin +2 more | 2007-12-11 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2007-10-09 |
| 7232363 | Polishing solution retainer | Hanzhong Zhang, Stan Tsai, Rashid Mavliev, Donald Olgado, Liang-Yuh Chen | 2007-06-19 |
| 7232514 | Method and composition for polishing a substrate | Stan Tsai, Yongqi Hu, Siew Neo, Yan Wang, Alain Duboust +1 more | 2007-06-19 |
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs | Yan Wang, Alain Duboust, Siew Neo, Liang-Yuh Chen, Yongqi Hu | 2007-06-12 |
| 7210988 | Method and apparatus for reduced wear polishing pad conditioning | Yan Wang, Stan Tsai, Yongqi Hu, Liang-Yuh Chen, Daxin Mao +4 more | 2007-05-01 |
| 7207878 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Antoine P. Manens, Siew Neo +5 more | 2007-04-24 |
| 7160432 | Method and composition for polishing a substrate | Liang-Yuh Chen, Stan Tsai, Alain Duboust, Siew Neo, Yongqi Hu +2 more | 2007-01-09 |
| 7128825 | Method and composition for polishing a substrate | Stan Tsai, Yongqi Hu, Siew Neo, Yan Wang, Alain Duboust +1 more | 2006-10-31 |
| 7104869 | Barrier removal at low polish pressure | Stan Tsai, Rashid Mavliev, Lizhong Sun, Liang-Yuh Chen, Ratson Morad | 2006-09-12 |
| 7084064 | Full sequence metal and barrier layer electrochemical mechanical processing | Liang-Yuh Chen, Stan Tsai, Yongqi Hu | 2006-08-01 |
| 7077721 | Pad assembly for electrochemical mechanical processing | Yongqi Hu, Stan Tsai, Yan Wang, Shou-Sung Chang, Liang-Yuh Chen | 2006-07-18 |
| 7060606 | Method and apparatus for chemical mechanical polishing of semiconductor substrates | Stan Tsai, Liang-Yuh Chen, Lizhong Sun, Shijian Li, Rashid Mavliev +2 more | 2006-06-13 |
| 7049386 | Compositions and methods for thermosetting molecules in organic compositions | Kreisler Lau, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek | 2006-05-23 |
| 7012025 | Tantalum removal during chemical mechanical polishing | Lizhong Sun, Stan Tsai, Shijian Li | 2006-03-14 |
| 7008554 | Dual reduced agents for barrier removal in chemical mechanical polishing | Stan Tsai, Shijian Li, Lizhong Sun, Liang-Yuh Chen | 2006-03-07 |
| 6991528 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Antoine P. Manens, Siew Neo +5 more | 2006-01-31 |