Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7223526 | Method of depositing an amorphous carbon layer | Kevin Fairbairn, Michael R. Rice, Timothy Weidman, Ian Latchford, Christopher Dennis Bencher +1 more | 2007-05-29 |
| 7105442 | Ashable layers for reducing critical dimensions of integrated circuit features | Hongching Shan, Kenny L. Doan, Jingbao Liu, Michael Barnes, Hong Dang Nguyen +4 more | 2006-09-12 |
| 6946401 | Plasma treatment for copper oxide reduction | Judy H. Huang, Christopher Dennis Bencher, Sudha Rathi, Bok Hoen Kim | 2005-09-20 |
| 6841341 | Method of depositing an amorphous carbon layer | Kevin Fairbairn, Michael R. Rice, Timothy Weidman, Ian Latchford, Christopher Dennis Bencher +1 more | 2005-01-11 |
| 6797646 | Method of nitrogen doping of fluorinated silicate glass (FSG) while removing the photoresist layer | Christopher Dennis Bencher, Joe Feng, Peter Chen | 2004-09-28 |
| 6780753 | Airgap for semiconductor devices | Ian Latchford, Christopher Dennis Bencher, Michael D. Armacost, Timothy Weidman | 2004-08-24 |
| 6700202 | Semiconductor device having reduced oxidation interface | Judy H. Huang, Christopher Dennis Bencher, Sudha Rathi, Bok Hoen Kim | 2004-03-02 |
| 6656840 | Method for forming silicon containing layers on a substrate | Nagarajan Rajagopalan, Joe Feng, Meiyee Shek, Suketu Arun Parikh, Linh Thanh | 2003-12-02 |
| 6573030 | Method for depositing an amorphous carbon layer | Kevin Fairbairn, Michael R. Rice, Timothy Weidman, Ian Latchford, Christopher Dennis Bencher +1 more | 2003-06-03 |
| 6355571 | Method and apparatus for reducing copper oxidation and contamination in a semiconductor device | Judy H. Huang, Christopher Dennis Bencher, Sudha Rathi, Bok Hoen Kim | 2002-03-12 |
| 5441568 | Exhaust baffle for uniform gas flow pattern | Tom K. Cho | 1995-08-15 |