MB

Milind S. Bhagavat

AM AMD: 45 patents #170 of 9,279Top 2%
Apple: 8 patents #3,815 of 18,612Top 25%
MM Memc Electronic Materials: 6 patents #35 of 273Top 15%
Broadcom: 4 patents #2,593 of 9,346Top 30%
AD Analog Devices: 3 patents #564 of 1,943Top 30%
📍 Broomfield, CO: #14 of 1,198 inventorsTop 2%
🗺 Colorado: #221 of 40,980 inventorsTop 1%
Overall (All Time): #33,368 of 4,157,543Top 1%
65
Patents All Time

Issued Patents All Time

Showing 51–65 of 65 patents

Patent #TitleCo-InventorsDate
9679187 Finger biometric sensor assembly including direct bonding interface and related methods Patrick E. O'Brien, Jun Zhai, Dale R. Setlak, David D. Coons, Kwan-Yu Lai 2017-06-13
9305959 Biometric sensor chip having distributed sensor and control circuitry Jun Zhai 2016-04-05
9287189 Flexible routing for chip on board applications Javed Iqbal Sandhu, Rezaur Rahman Khan, Teck Yang Tan 2016-03-15
9236442 Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections Sampath Komarapalayam Velayudham Karikalan, Rezaur Rahman Khan 2016-01-12
9123698 Flexural plate wave device for chip cooling Seyed Mahdi Saeidi, Tak Sang Yeung 2015-09-01
8817472 Methods and systems for on-chip osmotic airflow cooling Sam Ziqun Zhao 2014-08-26
8593155 MEMS in-plane resonators Andrew Sparks 2013-11-26
8267745 Methods of grinding semiconductor wafers having improved nanotopology Puneet Gupta, Roland R. Vandamme, Takuto Kazama, Noriyuki Tachi 2012-09-18
8066553 Wafer clamping device for a double side grinder Puneet Gupta, Roland R. Vandamme, Takuto Kazama, Noriyuki Tachi 2011-11-29
8058144 Method for capping a MEMS wafer Erik Tarvin, Firas Sammoura, Kuang L. Yang, Andrew Sparks 2011-11-15
7981723 Capped wafer method and apparatus Xue'en Yang, Erik Tarvin 2011-07-19
7927185 Method for assessing workpiece nanotopology using a double side wafer grinder Roland R. Vandamme 2011-04-19
7662023 Double side wafer grinder and methods for assessing workpiece nanotopology Ronald D. Vandamme 2010-02-16
7601049 Double side wafer grinder and methods for assessing workpiece nanotopology Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura 2009-10-13
6613591 Method of estimating post-polishing waviness characteristics of a semiconductor wafer Yun-Biao Xin, Gary L. Anderson, Brent Teasley 2003-09-02