Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601395 | Methods for post-epitaxial warp prediction and control | Sumeet S. Bhagavat | 2017-03-21 |
| 9566687 | Center flex single side polishing head having recess and cap | Peter Albrecht, Sumeet S. Bhagavat, Alex Chu, Ichiro Yoshimura, Yunbiao Xin | 2017-02-14 |
| 9156187 | Methods for mounting an ingot on a wire saw | Sumeet S. Bhagavat, Carlo Zavattari, Yunbiao Xin | 2015-10-13 |
| 8712575 | Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder | Sumeet S. Bhagavat, Tomomi Komura | 2014-04-29 |
| 8310031 | Semiconductor and solar wafers | Guoqiang Zhang | 2012-11-13 |
| 8309464 | Methods for etching the edge of a silicon wafer | Henry F. Erk, Peter Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt +1 more | 2012-11-13 |
| 8267745 | Methods of grinding semiconductor wafers having improved nanotopology | Milind S. Bhagavat, Puneet Gupta, Takuto Kazama, Noriyuki Tachi | 2012-09-18 |
| 8192822 | Edge etched silicon wafers | Henry F. Erk, Peter Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt +1 more | 2012-06-05 |
| 8145342 | Methods and systems for adjusting operation of a wafer grinder using feedback from warp data | Sumeet S. Bhagavat, Tomomi Komura, Tomhiko Kaneko, Takuto Kazama | 2012-03-27 |
| 8066553 | Wafer clamping device for a double side grinder | Milind S. Bhagavat, Puneet Gupta, Takuto Kazama, Noriyuki Tachi | 2011-11-29 |
| 7927185 | Method for assessing workpiece nanotopology using a double side wafer grinder | Milind S. Bhagavat | 2011-04-19 |
| 7930058 | Nanotopography control and optimization using feedback from warp data | Sumeet S. Bhagavat, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama | 2011-04-19 |
| 7878883 | Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control | Puneet Gupta, Milind Kulkarni, Carlo Zavattari | 2011-02-01 |
| 7601049 | Double side wafer grinder and methods for assessing workpiece nanotopology | Sumeet S. Bhagavat, Milind S. Bhagavat, Tomomi Komura | 2009-10-13 |
| 7559825 | Method of polishing a semiconductor wafer | Henry F. Erk, Judith Ann Schmit | 2009-07-14 |
| 7416962 | Method for processing a semiconductor wafer including back side grinding | Wesley Harrison, David W. Gore | 2008-08-26 |
| 6200908 | Process for reducing waviness in semiconductor wafers | Ankur H. Desai, Dale A. Witte, Yun-Biao Xin | 2001-03-13 |
| 6114245 | Method of processing semiconductor wafers | Yun-Biao Xin, Zhijian Pei | 2000-09-05 |
| 5340437 | Process and apparatus for etching semiconductor wafers | Henry F. Erk | 1994-08-23 |