CZ

Carlo Zavattari

MM Memc Electronic Materials: 2 patents #85 of 273Top 35%
MS Memc Electronic Materials S.P.A.: 2 patents #6 of 38Top 20%
GC Globalwafers Co.: 1 patents #142 of 221Top 65%
SL Sunedison Semiconductor Limited: 1 patents #4 of 43Top 10%
📍 Somma Lombardo, IT: #16 of 98 inventorsTop 20%
Overall (All Time): #836,100 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
10315337 Methods and system for controlling a surface profile of a wafer Peter Albrecht, Sumeet S. Bhagavat, Vandan Tanna, Uwe Hermes 2019-06-11
9156187 Methods for mounting an ingot on a wire saw Sumeet S. Bhagavat, Yunbiao Xin, Roland R. Vandamme 2015-10-13
7878883 Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control Puneet Gupta, Milind Kulkarni, Roland R. Vandamme 2011-02-01
7223344 Method for treating an exhausted glycol-based slurry Guido Fragiacomo, Elio Portaluppi 2007-05-29
6941940 Wire saw and process for slicing multiple semiconductor ingots Ferdinando Severico, Paolo De Maria 2005-09-13
6231628 Method for the separation, regeneration and reuse of an exhausted glycol-based slurry Guido Fragiacomo 2001-05-15