Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12270768 | Method of processing a cleaved semiconductor wafer | Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, William L. Luter | 2025-04-08 |
| 12019031 | Cleaved semiconductor wafer imaging system | Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, William L. Luter | 2024-06-25 |
| 11921054 | Cleaved semiconductor wafer camera system | Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, William L. Luter | 2024-03-05 |
| 11367649 | Semiconductor substrate polishing methods | Hui Wang, Tracy Michelle Ragan, James Raymond Capstick | 2022-06-21 |
| 10811307 | Polishing slurries for polishing semiconductor wafers | Hui Wang, Tracy Michelle Ragan, James Raymond Capstick | 2020-10-20 |
| 10654193 | Methods and system for controlling a surface profile of a wafer | Peter Albrecht, Carlos Zavattari, Sumeet S. Bhagavat, Uwe Hermes | 2020-05-19 |
| 10315337 | Methods and system for controlling a surface profile of a wafer | Peter Albrecht, Carlo Zavattari, Sumeet S. Bhagavat, Uwe Hermes | 2019-06-11 |
| 10128146 | Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structures | Hui Wang, Tracy Michelle Ragan, James Raymond Capstick | 2018-11-13 |