JV

John F. Valley

GC Globalwafers Co.: 7 patents #40 of 221Top 20%
S( Sunedison Semiconductor Limited (Uen201334164H): 2 patents #13 of 46Top 30%
SL Sunedison Semiconductor Limited: 1 patents #4 of 43Top 10%
KL Kla-Tencor: 1 patents #316 of 626Top 55%
📍 Lake Oswego, OR: #122 of 769 inventorsTop 20%
🗺 Oregon: #3,905 of 28,073 inventorsTop 15%
Overall (All Time): #434,803 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12270768 Method of processing a cleaved semiconductor wafer Benjamin Michael Meyer, Justin Scott Kayser, James Dean Eoff, Vandan Tanna, William L. Luter 2025-04-08
12019031 Cleaved semiconductor wafer imaging system Benjamin Michael Meyer, Justin Scott Kayser, James Dean Eoff, Vandan Tanna, William L. Luter 2024-06-25
11921054 Cleaved semiconductor wafer camera system Benjamin Michael Meyer, Justin Scott Kayser, James Dean Eoff, Vandan Tanna, William L. Luter 2024-03-05
10910280 Methods for separating bonded wafer structures Justin Scott Kayser, James Dean Eoff 2021-02-02
10679908 Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures Justin Scott Kayser, James Dean Eoff 2020-06-09
10636136 Wafer nanotopography metrology for lithography based on thickness maps 2020-04-28
10062158 Wafer nanotopography metrology for lithography based on thickness maps 2018-08-28
10030964 Systems and methods for performing phase shift interferometry while a wafer is vibrating Benno Orschel, Andrey Melnikov, Markus Jan Peter Siegert 2018-07-24
9665931 Air pocket detection methods and systems 2017-05-30
9317912 Symmetry based air pocket detection methods and systems 2016-04-19
7324917 Method, system, and software for evaluating characteristics of a surface with reference to its edge Chris L. Koliopoulos, Jaydeep Sinha, Delvin A. Lindley, Noel S. Poduje 2008-01-29