Issued Patents All Time
Showing 26–50 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Rajesh Katkar +1 more | 2024-04-23 |
| 11955393 | Structures for bonding elements including conductive interface features | Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Cyprian Emeka Uzoh | 2024-04-09 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Laura Wills Mirkarimi +3 more | 2024-04-09 |
| 11955445 | Metal pads over TSV | Guilian Gao, Bongsub Lee, Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2024-04-09 |
| 11855064 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Guilian Gao | 2023-12-26 |
| 11791307 | DBI to SI bonding for simplified handle wafer | Chandrasekhar Mandalapu, Guilian Gao | 2023-10-17 |
| 11756880 | Interconnect structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2023-09-12 |
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11664357 | Techniques for joining dissimilar materials in microelectronics | Chandrasekhar Mandalapu, Laura Wills Mirkarimi | 2023-05-30 |
| 11652083 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Laura Wills Mirkarimi | 2023-05-16 |
| 11631586 | Heterogeneous annealing method | Paul M. Enquist | 2023-04-18 |
| 11552041 | Chemical mechanical polishing for hybrid bonding | Chandrasekhar Mandalapu, Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2023-01-10 |
| 11515202 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2022-11-29 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Bongsub Lee, Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2022-07-19 |
| 11355404 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Laura Wills Mirkarimi | 2022-06-07 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Rajesh Katkar +1 more | 2022-04-05 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Laura Wills Mirkarimi +3 more | 2022-04-05 |
| 11289372 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2022-03-29 |
| 11158573 | Interconnect structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2021-10-26 |
| 11037919 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Guilian Gao | 2021-06-15 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Guilian Gao, Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed, Cyprian Emeka Uzoh | 2021-05-18 |
| 11011418 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2021-05-18 |
| 11004757 | Bonded structures | Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Cyprian Emeka Uzoh | 2021-05-11 |
| 10964664 | DBI to Si bonding for simplified handle wafer | Chandrasekhar Mandalapu, Guilian Gao | 2021-03-30 |
| 10896902 | Systems and methods for efficient transfer of semiconductor elements | Cyprian Emeka Uzoh, Paul M. Enquist | 2021-01-19 |