Issued Patents All Time
Showing 51–75 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879212 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Laura Wills Mirkarimi | 2020-12-29 |
| 10840205 | Chemical mechanical polishing for hybrid bonding | Chandrasekhar Mandalapu, Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2020-11-17 |
| 10777533 | Heterogeneous device | Paul M. Enquist | 2020-09-15 |
| 10748824 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Paul M. Enquist, Ilyas Mohammed | 2020-08-18 |
| 10727219 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Guilian Gao | 2020-07-28 |
| 10658313 | Selective recess | Javier A. Delacruz, Rajesh Katkar, Shaowu Huang, Liang Wang, Laura Wills Mirkarimi | 2020-05-19 |
| 10607937 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Javier A. Delacruz | 2020-03-31 |
| 10529634 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Paul M. Enquist, Ilyas Mohammed | 2020-01-07 |
| 10446532 | Systems and methods for efficient transfer of semiconductor elements | Cyprian Emeka Uzoh, Paul M. Enquist | 2019-10-15 |
| 10366962 | Three dimensional device integration method and integrated device | Paul M. Enquist | 2019-07-30 |
| 10312217 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2019-06-04 |
| 10269708 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Javier A. Delacruz | 2019-04-23 |
| 10147641 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2018-12-04 |
| 9852988 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Javier A. Delacruz | 2017-12-26 |
| 9716033 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2017-07-25 |
| 9698126 | Heterogeneous annealing method and device | Paul M. Enquist | 2017-07-04 |
| 9564414 | Three dimensional device integration method and integrated device | Paul M. Enquist | 2017-02-07 |
| 9431368 | Three dimensional device integration method and integrated device | Paul M. Enquist | 2016-08-30 |
| 9391143 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2016-07-12 |
| 9331149 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2016-05-03 |
| 9184125 | Heterogeneous annealing method and device | Paul M. Enquist | 2015-11-10 |
| 9171756 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2015-10-27 |
| 9082627 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2015-07-14 |
| 8735219 | Heterogeneous annealing method and device | Paul M. Enquist | 2014-05-27 |
| 8709938 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2014-04-29 |