Issued Patents All Time
Showing 76–94 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8389378 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2013-03-05 |
| 8153505 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2012-04-10 |
| 8053329 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2011-11-08 |
| 7956447 | Wafer scale die handling | Paul M. Enquist, Carl T. Petteway | 2011-06-07 |
| 7871898 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2011-01-18 |
| 7807549 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2010-10-05 |
| 7622324 | Wafer bonding hermetic encapsulation | Paul M. Enquist, Qin-Yi Tong, Robert J. Markunas | 2009-11-24 |
| 7553744 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2009-06-30 |
| 7485968 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2009-02-03 |
| 7462552 | Method of detachable direct bonding at low temperatures | Qin-Yi Tong | 2008-12-09 |
| 7387944 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2008-06-17 |
| 7335572 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2008-02-26 |
| 7126212 | Three dimensional device integration method and integrated device | Paul M. Enquist | 2006-10-24 |
| 7112536 | Plasma processing system and method | Robert J. Markunas, Robert Hendry | 2006-09-26 |
| 7041178 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2006-05-09 |
| 6902987 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2005-06-07 |
| 6822326 | Wafer bonding hermetic encapsulation | Paul M. Enquist, Qin-Yi Tong, Robert J. Markunas | 2004-11-23 |
| 6558504 | Plasma processing system and method | Robert J. Markunas, Robert Hendry | 2003-05-06 |
| 5168330 | Semiconductor device having a semiconductor substrate interfaced to a dissimilar material by means of a single crystal pseudomorphic interlayer | Daniel J. Vitkavage, Sunil Hattangady, Ronald A. Rudder, Robert J. Markunas | 1992-12-01 |