| 6956267 |
Semiconductor with a nitrided silicon gate oxide and method |
Jaideep Mavoori, Che-Jen Hu, Rajesh Khamankar |
2005-10-18 |
| 6780719 |
Method for annealing ultra-thin, high quality gate oxide layers using oxidizer/hydrogen mixtures |
Hiroaki Niimi, Rajesh Khamankar, James Joseph Chambers, Antonio Luis Pacheco Rotondaro |
2004-08-24 |
| 6716695 |
Semiconductor with a nitrided silicon gate oxide and method |
Jaideep Mavoori, Che-Jen Hu, Rajesh Khamankar |
2004-04-06 |
| 6632747 |
Method of ammonia annealing of ultra-thin silicon dioxide layers for uniform nitrogen profile |
Hiroaki Niimi, Douglas T. Grider, Rajesh Khamankar |
2003-10-14 |
| 6610614 |
Method for uniform nitridization of ultra-thin silicon dioxide layers in transistor gates |
Hiroaki Niimi, Rajesh Khamankar |
2003-08-26 |
| 6423648 |
Controllable oxidation technique for the formation of high-quality ultra-thin gate oxide using carbon dioxide as the oxidizing agent |
Ming-Jang Hwang, Paul Tiner |
2002-07-23 |
| 6420729 |
Process to produce ultrathin crystalline silicon nitride on Si (111) for advanced gate dielectrics |
Robert M. Wallace, Glen Wilk, Yi Wei |
2002-07-16 |
| 6399445 |
Fabrication technique for controlled incorporation of nitrogen in gate dielectric |
Srikanth Krishnan, Robert J. Kraft |
2002-06-04 |
| 6352941 |
Controllable oxidation technique for high quality ultrathin gate oxide formation |
Ming-Jang Hwang, Paul Tiner |
2002-03-05 |
| 6331492 |
Nitridation for split gate multiple voltage devices |
George R. Misium |
2001-12-18 |
| 6323114 |
Stacked/composite gate dielectric which incorporates nitrogen at an interface |
Tad Grider, John W. Kuehne |
2001-11-27 |
| 6277681 |
Process to produce ultrathin crystalline silicon nitride on Si(111) for advanced gate dielectrics |
Robert M. Wallace, Glen Wilk, Yi Wei |
2001-08-21 |
| 6268296 |
Low temperature process for multiple voltage devices |
George R. Misium |
2001-07-31 |
| 6261973 |
Remote plasma nitridation to allow selectively etching of oxide |
George R. Misium |
2001-07-17 |
| 6251761 |
Process for polycrystalline silicon gates and high-K dielectric compatibility |
Mark S. Rodder |
2001-06-26 |
| 6140024 |
Remote plasma nitridation for contact etch stop |
George R. Misium |
2000-10-31 |
| 6136654 |
Method of forming thin silicon nitride or silicon oxynitride gate dielectrics |
Robert J. Kraft, Douglas T. Grider |
2000-10-24 |
| 6110842 |
Method of forming multiple gate oxide thicknesses using high density plasma nitridation |
Yasutoshi Okuno |
2000-08-29 |
| 5989962 |
Semiconductor device having dual gate and method of formation |
Thomas C. Holloway |
1999-11-23 |
| 5970345 |
Method of forming an integrated circuit having both low voltage and high voltage MOS transistors |
George R. Misium |
1999-10-19 |
| 5168330 |
Semiconductor device having a semiconductor substrate interfaced to a dissimilar material by means of a single crystal pseudomorphic interlayer |
Daniel J. Vitkavage, Gaius Gillman Fountain, Jr., Ronald A. Rudder, Robert J. Markunas |
1992-12-01 |