| 7169619 |
Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process |
Yong Liang, Ravindranath Droopad, Xiaoming Hu, Jun Wang, Zhiyi Yu |
2007-01-30 |
|
| 7132372 |
Method for preparing a semiconductor substrate surface for semiconductor device fabrication |
Steven M. Smith, Diana J. Convey, Andy E. Hooper |
2006-11-07 |
|
| 6765619 |
Method and apparatus for optimizing exposure time in image acquisitions |
Zhonghan Deng, David Xiao Dong Yang, Xi Peng, Odutola Oluseye Ewedemi, Ricardo J. Motta |
2004-07-20 |
|
| 6730977 |
Lower temperature method for forming high quality silicon-nitrogen dielectrics |
Glen Wilk, John Mark Anthony, Robert M. Wallace |
2004-05-04 |
$10,969,000 |
| 6613698 |
Lower temperature method for forming high quality silicon-nitrogen dielectrics |
Glen Wilk, John Mark Anthony, Robert M. Wallace |
2003-09-02 |
$28,001,000 |
| 6545258 |
Photo-sensor cross-section for increased quantum efficiency |
Hui Tian, William R. Bidermann, David Xiao Dong Yang |
2003-04-08 |
|
| 6420729 |
Process to produce ultrathin crystalline silicon nitride on Si (111) for advanced gate dielectrics |
Robert M. Wallace, Glen Wilk, Sunil Hattangady |
2002-07-16 |
$34,449,000 |
| 6277681 |
Process to produce ultrathin crystalline silicon nitride on Si(111) for advanced gate dielectrics |
Robert M. Wallace, Glen Wilk, Sunil Hattangady |
2001-08-21 |
$63,861,000 |
| 6274510 |
Lower temperature method for forming high quality silicon-nitrogen dielectrics |
Glen Wilk, John Mark Anthony, Robert M. Wallace |
2001-08-14 |
$35,416,000 |
| 6258637 |
Method for thin film deposition on single-crystal semiconductor substrates |
Glen Wilk, Robert M. Wallace |
2001-07-10 |
$54,039,000 |
| 6040230 |
Method of forming a nano-rugged silicon-containing layer |
John Mark Anthony, Robert M. Wallace, Glen Wilk |
2000-03-21 |
$107,796,000 |
| 6031258 |
High DC current stagger power/ground pad |
Nalini Ranjan, Henry H. Yang, Gregg BARDEL |
2000-02-29 |
$26,277,000 |
| 6020247 |
Method for thin film deposition on single-crystal semiconductor substrates |
Glen Wilk, Robert M. Wallace |
2000-02-01 |
$74,681,000 |
| 5830532 |
Method to produce ultrathin porous silicon-oxide layer |
Shaoping Tang, Robert M. Wallace |
1998-11-03 |
$20,775,000 |
| 5659197 |
Hot-carrier shield formation for bipolar transistor |
— |
1997-08-19 |
$5,051,000 |
| 5631485 |
ESD and hot carrier resistant integrated circuit structure |
Ying-Tsong Loh, Chung S. Wang, Chenming Hu |
1997-05-20 |
$9,220,000 |
| 5504364 |
CMOS locos isolation for self-aligned NPN BJT in a BiCMOS process |
Kuang-Yeh Chang |
1996-04-02 |
$3,158,000 |
| 5496751 |
Method of forming an ESD and hot carrier resistant integrated circuit structure |
Ying-Tsong Loh, Chung S. Wang, Chenming Hu |
1996-03-05 |
$2,773,000 |
| 5391502 |
Per-wafer method for globally stressing gate oxide during device fabrication |
— |
1995-02-21 |
$937,000 |
| 5342794 |
Method for forming laterally graded deposit-type emitter for bipolar transistor |
— |
1994-08-30 |
$1,499,000 |
| 5208719 |
Output pad electrostatic discharge protection circuit for MOS devices |
— |
1993-05-04 |
$926,000 |