Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7081403 | Thin leadless plastic chip carrier | Mohan Kirloskar, Kwok Cheung Tsang, Kin Pui Kwan | 2006-07-25 |
| 7049177 | Leadless plastic chip carrier with standoff contacts and die attach pad | Wing Him Lau, Kenneth Kwan, Janet Wong | 2006-05-23 |
| 7033517 | Method of fabricating a leadless plastic chip carrier | Mohan Kirloskar | 2006-04-25 |
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Hau Ng, Neil Robert McLellen | 2006-03-21 |
| 7009286 | Thin leadless plastic chip carrier | Mohan Kirloskar, Kwok Cheung Tsang, Kin Pui Kwan | 2006-03-07 |
| 6995460 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2006-02-07 |
| 6989294 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2006-01-24 |
| 6987032 | Ball grid array package and process for manufacturing same | Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Neil McLellan, Mohan Kirloskar | 2006-01-17 |
| 6982491 | Sensor semiconductor package and method of manufacturing the same | Sadak Thamby Labeeb, Lap Keung Chow | 2006-01-03 |
| 6979594 | Process for manufacturing ball grid array package | Sadak Thamby Labeeb, Ming Wang Sze | 2005-12-27 |
| 6964918 | Electronic components such as thin array plastic packages and process for fabricating same | Kwok Cheung Tsang | 2005-11-15 |
| 6946324 | Process for fabricating a leadless plastic chip carrier | Neil McLellan, Kin Pui Kwan, Wing Him Lau | 2005-09-20 |
| 6933176 | Ball grid array package and process for manufacturing same | Mohan Kirloskar, Neil McLellan | 2005-08-23 |
| 6933594 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2005-08-23 |
| 6903304 | Process for dressing molded array package saw blade | Neil McLellan, Geraldine Tsui Yee Lin, John Ping Sheung Lau | 2005-06-07 |
| 6872661 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Neil McLellan | 2005-03-29 |
| 6818978 | Ball grid array package with shielding | — | 2004-11-16 |
| 6818472 | Ball grid array package | Joseph Martin, Ming Wang Sze, Tak Sang Yeung | 2004-11-16 |
| 6800948 | Ball grid array package | Joseph Martin, Ming Wang Sze, Tak Sang Yeung | 2004-10-05 |
| 6790710 | Method of manufacturing an integrated circuit package | Neil McLellan, Edward Combs, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb | 2004-09-14 |
| 6781242 | Thin ball grid array package | Kwok Cheung Tsang, William Lap Keung Chow | 2004-08-24 |
| 6734552 | Enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Neil Robert McLellen | 2004-05-11 |
| 6734044 | Multiple leadframe laminated IC package | Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong | 2004-05-11 |
| 6635957 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Neil McLellan | 2003-10-21 |
| 6585905 | Leadless plastic chip carrier with partial etch die attach pad | Tsui Yee Lin, Kin Yan Tsang, Neil McLellan | 2003-07-01 |