Issued Patents 2025
Showing 76–81 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205861 | Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate | Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen | 2025-01-21 |
| 12198996 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang, Po-Yao Chuang | 2025-01-14 |
| 12199084 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Meng-Wei Chou, Meng-Liang Lin | 2025-01-14 |
| 12191261 | Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture | Po-Yao Chuang, Meng-Wei Chou | 2025-01-07 |
| 12191294 | Package structure and method of forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Yu-Sheng Lin | 2025-01-07 |
| 12191272 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin | 2025-01-07 |