Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148744 | Optical multichip package with multiple system-on-chip dies | Zhichao Zhang, Suresh Pothukuchi, Xiaoqian Li, Omkar G. Karhade | 2024-11-19 |
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Zhiguo Qian, Gang Duan, Jieying Kong, Brandon C. Marin | 2024-10-22 |
| 12062616 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2024-08-13 |
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Jianyong Xie, Arghya Sain, Xiaohong Jiang, Sujit Sharan | 2024-08-06 |
| 12009320 | Interconnect loss of high density package with magnetic material | Zhiguo Qian, Cemil Geyik, Jiwei Sun, Gang Duan | 2024-06-11 |
| 11983135 | Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge | Dheeraj Subbareddy, Ankireddy Nalamalpu, Anshuman Thakur, MD Altaf Hossain, Mahesh Kumashikar +3 more | 2024-05-14 |
| 11923308 | Die interconnect structures having bump field and ground plane | Zhiguo Qian | 2024-03-05 |
| 11903138 | Fine feature formation techniques for printed circuit boards | Eric J. Li, Kai Xiao, Gong Ouyang, Zhichao Zhang | 2024-02-13 |
| 11901280 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2024-02-13 |
| 11887932 | Dielectric-filled trench isolation of vias | Zhiguo Qian, Jianyong Xie | 2024-01-30 |