Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Tarek A. Ibrahim +9 more | 2024-07-09 |
| 11955448 | Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches | Jung Kyu Han, Xiaoying Guo, Rahul N. Manepalli | 2024-04-09 |
| 11948898 | Etch barrier for microelectronic packaging conductive structures | Kristof Darmawikarta, Srinivas V. Pietambaram, Xiaoying Guo, Benjamin Duong | 2024-04-02 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |