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Cleaning method with in-line SPM processing |
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Polishing carrier head with piezoelectric pressure control |
Andrew J. Nagengast, Justin Ho Kuen Wong |
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| 12027382 |
Surface cleaning with directed high pressure chemistry |
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| 11951589 |
Wafer edge asymmetry correction using groove in polishing pad |
Jimin Zhang, Jianshe Tang, Wei Lu, Priscilla Diep |
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| 11931854 |
Chemical mechanical polishing using time share control |
Jimin Zhang, Jianshe Tang, Wei Lu, Priscilla Diep LaRosa |
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| 11931853 |
Control of processing parameters for substrate polishing with angularly distributed zones using cost function |
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| 11897079 |
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity |
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| 11890715 |
Polishing carrier head with piezoelectric pressure control |
Andrew J. Nagengast, Justin Ho Kuen Wong |
2024-02-06 |
