Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148149 | Training a machine learning system to detect an excursion of a CMP component using time-based sequence of images | Sidney P. Huey, Thomas Li | 2024-11-19 |
| 12136574 | Technique for training neural network for use in in-situ monitoring during polishing and polishing system | Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more | 2024-11-05 |
| 12090599 | Determination of substrate layer thickness with polishing pad wear compensation | Kun Xu, Jun Qian, Kiran Shrestha | 2024-09-17 |
| 12079984 | Detecting an excursion of a CMP component using time-based sequence of images | Sidney P. Huey, Thomas Li | 2024-09-03 |
| 12057354 | Trained neural network in in-situ monitoring during polishing and polishing system | Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more | 2024-08-06 |
| 12020159 | Training spectrum generation for machine learning system for spectrographic monitoring | Nicholas A. Wiswell, Jun Qian, Thomas H. Osterheld | 2024-06-25 |
| 11969854 | Control of processing parameters during substrate polishing using expected future parameter changes | Sivakumar Dhandapani | 2024-04-30 |
| 11966212 | Spectrographic monitoring using a neural network | — | 2024-04-23 |
| 11931853 | Control of processing parameters for substrate polishing with angularly distributed zones using cost function | Eric Lau, Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Brian J. Brown +1 more | 2024-03-19 |
| 11919121 | Control of processing parameters during substrate polishing using constrained cost function | Sivakumar Dhandapani | 2024-03-05 |
| 11865664 | Profile control with multiple instances of contol algorithm during polishing | Kun Xu, Harry Q. Lee, David Maxwell Gage | 2024-01-09 |
| 11865671 | Temperature-based in-situ edge assymetry correction during CMP | Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen +1 more | 2024-01-09 |