| 12148149 |
Training a machine learning system to detect an excursion of a CMP component using time-based sequence of images |
Sidney P. Huey, Thomas Li |
2024-11-19 |
| 12136574 |
Technique for training neural network for use in in-situ monitoring during polishing and polishing system |
Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more |
2024-11-05 |
| 12090599 |
Determination of substrate layer thickness with polishing pad wear compensation |
Kun Xu, Jun Qian, Kiran Shrestha |
2024-09-17 |
| 12079984 |
Detecting an excursion of a CMP component using time-based sequence of images |
Sidney P. Huey, Thomas Li |
2024-09-03 |
| 12057354 |
Trained neural network in in-situ monitoring during polishing and polishing system |
Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more |
2024-08-06 |
| 12020159 |
Training spectrum generation for machine learning system for spectrographic monitoring |
Nicholas A. Wiswell, Jun Qian, Thomas H. Osterheld |
2024-06-25 |
| 11969854 |
Control of processing parameters during substrate polishing using expected future parameter changes |
Sivakumar Dhandapani |
2024-04-30 |
| 11966212 |
Spectrographic monitoring using a neural network |
— |
2024-04-23 |
| 11931853 |
Control of processing parameters for substrate polishing with angularly distributed zones using cost function |
Eric Lau, Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Brian J. Brown +1 more |
2024-03-19 |
| 11919121 |
Control of processing parameters during substrate polishing using constrained cost function |
Sivakumar Dhandapani |
2024-03-05 |
| 11865664 |
Profile control with multiple instances of contol algorithm during polishing |
Kun Xu, Harry Q. Lee, David Maxwell Gage |
2024-01-09 |
| 11865671 |
Temperature-based in-situ edge assymetry correction during CMP |
Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen +1 more |
2024-01-09 |
