Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11931853 | Control of processing parameters for substrate polishing with angularly distributed zones using cost function | Eric Lau, Charles C. Garretson, Huanbo Zhang, Benjamin Cherian, Brian J. Brown +1 more | 2024-03-19 |
| 11869815 | Asymmetry correction via oriented wafer loading | Eric Lau, Charles C. Garretson, Huanbo Zhang | 2024-01-09 |