Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11986923 | Polishing head with local wafer pressure | Andrew J. Nagengast, Steven M. Zuniga, Jay Gurusamy, Vladimir Galburt | 2024-05-21 |
| 11931853 | Control of processing parameters for substrate polishing with angularly distributed zones using cost function | Eric Lau, Huanbo Zhang, Zhize Zhu, Benjamin Cherian, Brian J. Brown +1 more | 2024-03-19 |
| 11869815 | Asymmetry correction via oriented wafer loading | Eric Lau, Huanbo Zhang, Zhize Zhu | 2024-01-09 |