Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142513 | Wafer processing tools and methods thereof | Jagan Rangarajan, Edward Golubovsky, Shaun Van Der Veen, Justin Ho Kuen Wong | 2024-11-12 |
| 12128524 | Membrane for carrier head with segmented substrate chuck | Jay Gurusamy | 2024-10-29 |
| 12076877 | Polishing platens and polishing platen manufacturing methods | Bum Jick Kim, Danielle Loi, Jay Gurusamy | 2024-09-03 |
| 12048981 | Retaining ring having inner surfaces with features | Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Andrew J. Nagengast, Samuel Chu-Chiang Hsu +1 more | 2024-07-30 |
| 12042899 | Polishing head with membrane position control | Jay Gurusamy | 2024-07-23 |
| 12033865 | Retaining ring having inner surfaces with facets | Jeonghoon Oh, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate | 2024-07-09 |
| 11986923 | Polishing head with local wafer pressure | Andrew J. Nagengast, Jay Gurusamy, Charles C. Garretson, Vladimir Galburt | 2024-05-21 |
| 11958164 | Stepped retaining ring | Shaun Van Der Veen | 2024-04-16 |
| 11945073 | Dual membrane carrier head for chemical mechanical polishing | Jay Gurusamy, Andrew J. Nagengast | 2024-04-02 |
| 11931857 | Deformable substrate chuck | Jay Gurusamy, Andrew J. Nagengast | 2024-03-19 |
| 11919120 | Polishing system with contactless platen edge control | David J. Lischka, Jay Gurusamy, Danielle Loi | 2024-03-05 |
| 11904429 | Substrate polishing apparatus with contact extension or adjustable stop | Andrew J. Nagengast, Jay Gurusamy | 2024-02-20 |
| 11890717 | Polishing system with platen for substrate edge control | Jay Gurusamy, Jeonghoon Oh | 2024-02-06 |