Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106976 | Steam-assisted single substrate cleaning process and apparatus | Wei Lu, Haosheng Wu, Taketo Sekine, Shou-Sung Chang, Hari Soundararajan +1 more | 2024-10-01 |
| 12030093 | Steam treatment stations for chemical mechanical polishing system | Haosheng Wu, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou +2 more | 2024-07-09 |
| 11986926 | Slurry distribution device for chemical mechanical polishing | Yen-Chu Yang, Stephen Jew, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield +2 more | 2024-05-21 |
| 11951589 | Wafer edge asymmetry correction using groove in polishing pad | Jimin Zhang, Brian J. Brown, Wei Lu, Priscilla Diep | 2024-04-09 |
| 11948885 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Rong Tao, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli +3 more | 2024-04-02 |
| 11931854 | Chemical mechanical polishing using time share control | Jimin Zhang, Brian J. Brown, Wei Lu, Priscilla Diep LaRosa | 2024-03-19 |
| 11897079 | Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity | Haosheng Wu, Hari Soundararajan, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang +2 more | 2024-02-13 |
| 11865671 | Temperature-based in-situ edge assymetry correction during CMP | Haosheng Wu, Shou-Sung Chang, Chih Chung Chou, Hui Chen, Hari Soundararajan +1 more | 2024-01-09 |