Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183631 | Methods for copper doped hybrid metallization for line and via | Suketu Arun Parikh, Alexander Jansen, Lequn Liu | 2024-12-31 |
| 12104243 | Methods and apparatus for processing a substrate | Annamalai Lakshmanan, Jacqueline S. Wrench, Feihu Wang, Yixiong Yang, Srinivas Gandikota +3 more | 2024-10-01 |
| 12094699 | Methods and apparatus for controlling ion fraction in physical vapor deposition processes | Xiaodong Wang, Fuhong Zhang, Martin Lee Riker, Keith A. Miller, William Fruchterman +4 more | 2024-09-17 |
| 12094785 | Dual silicide process using ruthenium silicide | Thomas Anthony Empante, Avgerinos V. Gelatos, Zhibo Yuan, Liqi Wu, Byunghoon Yoon | 2024-09-17 |
| 12022650 | Low resistivity DRAM buried word line stack | Yixiong Yang, Jacqueline S. Wrench, Yong Yang, Srinivas Gandikota, Annamalai Lakshmanan +2 more | 2024-06-25 |
| 11948885 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Rong Tao, Roey Shaviv, Seshadri Ganguli, Shirish A. PETHE +3 more | 2024-04-02 |