Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183631 | Methods for copper doped hybrid metallization for line and via | Alexander Jansen, Joung Joo Lee, Lequn Liu | 2024-12-31 |
| 12148660 | Low resistance and high reliability metallization module | Roey Shaviv, Feng Chen, Lu Chen | 2024-11-19 |
| 12142487 | Methods of modifying portions of layer stacks | — | 2024-11-12 |
| 11948885 | Methods and apparatus for forming dual metal interconnects | Rong Tao, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli, Shirish A. PETHE +3 more | 2024-04-02 |