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Lequn Liu

Applied Materials: 1 patents #861 of 1,809Top 50%
📍 Boise, ID: #349 of 684 inventorsTop 55%
🗺 Idaho: #527 of 1,264 inventorsTop 45%
Overall (2024): #373,020 of 561,600Top 70%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12183631 Methods for copper doped hybrid metallization for line and via Suketu Arun Parikh, Alexander Jansen, Joung Joo Lee 2024-12-31