Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183631 | Methods for copper doped hybrid metallization for line and via | Suketu Arun Parikh, Joung Joo Lee, Lequn Liu | 2024-12-31 |
| 11955382 | Reverse selective etch stop layer | Kevin Kashefi, Mehul Naik, He Ren, Lu Chen, Feng Chen | 2024-04-09 |
| 11939666 | Methods and apparatus for precleaning and treating wafer surfaces | Xiangjin Xie, Carmen Leal Cervantes, Feng Chen, Lu Chen, Wenjing Xu +4 more | 2024-03-26 |
| 11891690 | Molybdenum thin films by oxidation-reduction | Feng Q. Liu, Mark Saly | 2024-02-06 |