Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046508 | Method of dielectric material fill and treatment | Shi YOU, He Ren, Naomi Yoshida, Nikolaos Bekiaris, Martin Jay Seamons +2 more | 2024-07-23 |
| 12002705 | Methods and apparatus for forming backside power rails | He Ren, Houssam Lazkani, Raman Gaire, Kuan-Ting Liu | 2024-06-04 |
| 11990368 | Doped selective metal caps to improve copper electromigration with ruthenium liner | Zhiyuan Wu | 2024-05-21 |
| 11967527 | Fully aligned subtractive processes and electronic devices therefrom | He Ren, Hao Jiang | 2024-04-23 |
| 11965236 | Method of forming nickel silicide materials | Minrui Yu, He Ren | 2024-04-23 |
| 11955382 | Reverse selective etch stop layer | Kevin Kashefi, Alexander Jansen, He Ren, Lu Chen, Feng Chen | 2024-04-09 |
| 11923244 | Subtractive metals and subtractive metal semiconductor structures | He Ren, Hao Jiang, Shi YOU | 2024-03-05 |
| 11908696 | Methods and devices for subtractive self-alignment | He Ren, Hao Jiang, Wenting Hou, Jianxin Lei, Chen Gong +1 more | 2024-02-20 |