Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Frank Truong | 2023-08-22 |
| 11688692 | Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias | Frank Truong, Jason M. Gamba, Robert Alan May | 2023-06-27 |
| 11652071 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Jeremy Ecton | 2023-05-16 |
| 11571876 | Dielectric film with pressure sensitive microcapsules of adhesion promoter | Frank Truong, Dilan Seneviratne | 2023-02-07 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |